
Lattice Semiconductor Corporation
LC4256B-75T100C
LC4256B-75T100C ECAD Model
LC4256B-75T100C Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ispMACH® 4000B | |
Package | Tray | |
Programmable Type | In System Programmable | |
Delay Time tpd(1) Max | 7.5 ns | |
Voltage Supply - Internal | 2.3V ~ 2.7V | |
Number of Logic Elements/Blocks | 16 | |
Number of Macrocells | 256 | |
Number of I/O | 64 | |
Operating Temperature | 0°C ~ 90°C (TJ) | |
Mounting Type | Surface Mount | |
Package / Case | 100-LQFP | |
Supplier Device Package | 100-TQFP (14x14) | |
Base Product Number | LC4256 |
LC4256B-75T100C Datasheet Download
LC4256B-75T100C Overview
The LC4256B-75T100C is a low-cost, low-power, high-performance, Field Programmable Gate Array (FPGA) chip model manufactured by Lattice Semiconductor. It is based on the LatticeECP2/M architecture, which is optimized for high-performance, low-power applications. This chip model is ideal for use in a variety of applications, including embedded systems, industrial automation, communications, and consumer electronics.
The LC4256B-75T100C has a total of 256 logic cells, with a total of 4,096 flip-flops and 4,096 look-up tables. It has a maximum operating frequency of up to 250 MHz, and a maximum I/O pin count of up to 100. It has a wide range of features, including built-in memory, high-speed I/O, high-speed clock management, and advanced power management. It also has a range of flexible I/O options, including LVDS, LVCMOS, and GTL.
The LC4256B-75T100C is designed to be used in a variety of applications, including automotive, consumer electronics, communications and industrial automation. It is also suitable for use in high-speed, low-power applications, such as medical imaging, video processing, and high-speed networking. The chip model is also suitable for use in a wide variety of embedded systems, such as embedded control systems, embedded vision systems, and embedded wireless systems.
Overall, the LC4256B-75T100C is an ideal chip model for a variety of applications, due to its low-cost, low-power, and high-performance features. It is suitable for use in a wide range of embedded systems and applications, and is ideal for use in high-speed, low-power applications.
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