ISPLSI 5512VE-100LF256
ISPLSI 5512VE-100LF256
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rohs

Lattice Semiconductor Corporation

ISPLSI 5512VE-100LF256


ISPLSI 5512VE-100LF256
F11-ISPLSI 5512VE-100LF256
Active
IC CPLD 512MC 10NS 256FBGA
256-FPBGA (17x17)

ISPLSI 5512VE-100LF256 ECAD Model


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ISPLSI 5512VE-100LF256 Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispLSI® 5000VE
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 10 ns
Voltage Supply - Internal 3V ~ 3.6V
Number of Logic Elements/Blocks 16
Number of Macrocells 512
Number of Gates 24000
Number of I/O 192
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number ISPLSI 5512VE

ISPLSI 5512VE-100LF256 Datasheet Download


ISPLSI 5512VE-100LF256 Overview



The ISPLSI 5512VE-100LF256 chip is a Field Programmable Gate Array (FPGA) device manufactured by Lattice Semiconductor. It is a low-cost, low-power, high-performance solution for a variety of applications.


The ISPLSI 5512VE-100LF256 chip has a capacity of 256 logic elements, and a total of 4,096 bits of embedded memory. It is designed to operate with a maximum clock frequency of 100 MHz, and a maximum power consumption of 1.5 W. It also features an integrated JTAG and SPI interface for programming and debugging, as well as an integrated oscillator.


The ISPLSI 5512VE-100LF256 chip is suitable for a wide range of applications, including embedded systems, consumer electronics, automotive, industrial, and medical. It is also suitable for applications that require high performance, low power consumption, and a low cost solution.


The ISPLSI 5512VE-100LF256 chip is RoHS compliant, and is available in a variety of packages, including a 100-pin TQFP package, a 144-pin TQFP package, and a 256-pin BGA package. It is also compatible with a wide range of development boards and software development tools.


In summary, the ISPLSI 5512VE-100LF256 chip is a low-cost, low-power, high-performance solution for a variety of applications, including embedded systems, consumer electronics, automotive, industrial, and medical. It features a capacity of 256 logic elements, 4,096 bits of embedded memory, a maximum clock frequency of 100 MHz, and a maximum power consumption of 1.5 W. It is also RoHS compliant, and is available in a variety of packages.



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