
Lattice Semiconductor Corporation
ISPLSI 5384VE-100LB272I
ISPLSI 5384VE-100LB272I ECAD Model
ISPLSI 5384VE-100LB272I Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ispLSI® 5000VE | |
Package | Tray | |
Programmable Type | In System Programmable | |
Delay Time tpd(1) Max | 10 ns | |
Voltage Supply - Internal | 3V ~ 3.6V | |
Number of Logic Elements/Blocks | 12 | |
Number of Macrocells | 384 | |
Number of Gates | 18000 | |
Number of I/O | 192 | |
Operating Temperature | -40°C ~ 85°C (TA) | |
Mounting Type | Surface Mount | |
Package / Case | 272-BBGA | |
Supplier Device Package | 272-BGA (27x27) | |
Base Product Number | ISPLSI 5384VE |
ISPLSI 5384VE-100LB272I Datasheet Download
ISPLSI 5384VE-100LB272I Overview
The ISPLSI 5384VE-100LB272I is a high-performance, low-power, field-programmable gate array (FPGA) chip designed by Lattice Semiconductor. It is based on the company's low-cost, non-volatile, low-power, 5384VE architecture. This chip is available in a variety of packages, including a 272-pin PQFP (Plastic Quad Flat Package). It is designed to provide a high level of integration and flexibility to meet the needs of a wide range of applications.
The ISPLSI 5384VE-100LB272I is a low-power, high-performance FPGA with a maximum clock frequency of 200 MHz. It has a total of 1.4 million system gates and can support up to 1,024 user I/O pins. It also features an embedded SRAM of up to 256 Kbits and can support up to 16Kbits of distributed RAM. It also features a dedicated phase-locked loop (PLL) for clock generation and distribution.
The ISPLSI 5384VE-100LB272I is ideal for a wide range of applications, including embedded systems, communications, industrial automation, medical devices, consumer electronics, and automotive systems. It is well suited for applications requiring low power consumption, high performance, and high integration. The chip's low-power and high-performance capabilities make it an ideal choice for applications that require low power consumption and high performance. Additionally, the chip's flexibility and high integration make it suitable for a wide range of applications.
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