ISPLSI 5256VE-125LB272
ISPLSI 5256VE-125LB272
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Lattice Semiconductor Corporation

ISPLSI 5256VE-125LB272


ISPLSI 5256VE-125LB272
F11-ISPLSI 5256VE-125LB272
Active
IC CPLD 256MC 7.5NS 272BGA
272-BGA (27x27)

ISPLSI 5256VE-125LB272 ECAD Model


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ISPLSI 5256VE-125LB272 Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispLSI® 5000VE
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 7.5 ns
Voltage Supply - Internal 3V ~ 3.6V
Number of Logic Elements/Blocks 8
Number of Macrocells 256
Number of Gates 12000
Number of I/O 144
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 272-BBGA
Supplier Device Package 272-BGA (27x27)
Base Product Number ISPLSI 5256VE

ISPLSI 5256VE-125LB272 Datasheet Download


ISPLSI 5256VE-125LB272 Overview



The ISPLSI 5256VE-125LB272 is a high-performance, low-power field programmable gate array (FPGA) from Lattice Semiconductor. It is designed for a wide range of applications, including embedded control, signal processing, and communications.


The ISPLSI 5256VE-125LB272 is a single-chip solution that offers a variety of features and capabilities. It has a maximum operating frequency of 125 MHz, and a total of 5256 logic elements (LEs). It also has a variety of I/O options, including LVDS, LVCMOS, and differential I/O, as well as a dedicated JTAG port. The chip is also equipped with an on-chip memory controller, allowing it to interface with external memory devices.


In terms of power consumption, the ISPLSI 5256VE-125LB272 is a low-power device, with a typical power consumption of just 1.5 W. This makes it suitable for battery-powered applications. The chip also features advanced power management capabilities, allowing it to reduce its power consumption when the system is idle.


The ISPLSI 5256VE-125LB272 is suitable for a wide range of applications, including automotive, industrial, consumer, and medical. It is also suitable for applications that require high performance, low power consumption, and flexibility, such as image processing and communications. In addition, the chip is compatible with a variety of development tools, including the Lattice Diamond software and the Lattice ISP design tools.



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