ISPLSI 5256VA-100LB208
ISPLSI 5256VA-100LB208
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Lattice Semiconductor Corporation

ISPLSI 5256VA-100LB208


ISPLSI 5256VA-100LB208
F11-ISPLSI 5256VA-100LB208
Active
IC CPLD 256MC 10NS 208FBGA
208-FPBGA (17x17)

ISPLSI 5256VA-100LB208 ECAD Model


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ISPLSI 5256VA-100LB208 Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispLSI® 5000VA
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 10 ns
Voltage Supply - Internal 3V ~ 3.6V
Number of Logic Elements/Blocks 8
Number of Macrocells 256
Number of Gates 12000
Number of I/O 144
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 208-BGA
Supplier Device Package 208-FPBGA (17x17)
Base Product Number ISPLSI 5256VA

ISPLSI 5256VA-100LB208 Datasheet Download


ISPLSI 5256VA-100LB208 Overview



The ISPLSI 5256VA-100LB208 is a Field Programmable Gate Array (FPGA) chip produced by Lattice Semiconductor. It is a low-power, low-cost device that can be used in a variety of applications.


The chip has a total of 100,000 logic elements, and is based on the LatticeXP2 architecture. It is capable of speeds up to 250 MHz, and has a maximum power dissipation of 2.5 W. The device also features an integrated phase-locked loop (PLL), and an on-chip oscillator. It is packaged in a 208-pin LFBGA package, and has an operating temperature range of 0 to 70 degrees Celsius.


The ISPLSI 5256VA-100LB208 is suitable for a wide range of applications, including embedded systems, communications, automotive, consumer, and medical applications. It can be used to create complex logic designs, such as digital signal processing and image processing. It is also well suited for applications that require high-speed and low-power operation, such as portable electronics and battery-powered devices.


Overall, the ISPLSI 5256VA-100LB208 is a versatile and cost-effective FPGA chip that is suitable for a variety of applications. It offers high performance, low power consumption, and a wide range of features, making it an ideal choice for embedded and consumer electronics applications.



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