ISPLSI 2096VE-200LT128
ISPLSI 2096VE-200LT128
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Lattice Semiconductor Corporation

ISPLSI 2096VE-200LT128


ISPLSI 2096VE-200LT128
F11-ISPLSI 2096VE-200LT128
Active
IC CPLD 96MC 4.5NS 128TQFP
128-TQFP (14x14)

ISPLSI 2096VE-200LT128 ECAD Model


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ISPLSI 2096VE-200LT128 Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispLSI® 2000VE
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 4.5 ns
Voltage Supply - Internal 3V ~ 3.6V
Number of Logic Elements/Blocks 24
Number of Macrocells 96
Number of Gates 4000
Number of I/O 96
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 128-LQFP
Supplier Device Package 128-TQFP (14x14)
Base Product Number ISPLSI 2096VE

ISPLSI 2096VE-200LT128 Datasheet Download


ISPLSI 2096VE-200LT128 Overview



The ISPLSI 2096VE-200LT128 is an FPGA (Field Programmable Gate Array) chip model manufactured by Lattice Semiconductor. It is a low-cost, low-power, high-performance device that is designed to meet the needs of a wide range of applications. It features a high-speed, low-power design with a 0.18-micron process technology.


The ISPLSI 2096VE-200LT128 has a total of 128 logic cells and is capable of supporting up to 2 million logic elements. It has a wide range of I/O options, including LVDS, LVCMOS, and LVPECL interfaces. It also has a wide range of memory options, including dual-port RAM, ROM, and Flash memory. It supports a wide range of clock frequencies, ranging from 10 MHz to 200 MHz.


The ISPLSI 2096VE-200LT128 is suitable for a wide range of applications, including embedded systems, industrial automation, medical devices, consumer electronics, and automotive electronics. It is suitable for applications that require high performance and low power consumption. Its low cost and high performance make it an ideal choice for cost-sensitive applications.


In summary, the ISPLSI 2096VE-200LT128 is a low-cost, low-power, high-performance FPGA chip model designed to meet the needs of a wide range of applications. It features a high-speed, low-power design with a 0.18-micron process technology and is suitable for a wide range of applications, including embedded systems, industrial automation, medical devices, consumer electronics, and automotive electronics.



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