ISPLSI 2064VE-135LB100
ISPLSI 2064VE-135LB100
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Lattice Semiconductor Corporation

ISPLSI 2064VE-135LB100


ISPLSI 2064VE-135LB100
F11-ISPLSI 2064VE-135LB100
Active
IC CPLD 64MC 7.5NS 100CABGA
100-CABGA (10x10)

ISPLSI 2064VE-135LB100 ECAD Model


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ISPLSI 2064VE-135LB100 Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispLSI® 2000VE
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 7.5 ns
Voltage Supply - Internal 3V ~ 3.6V
Number of Logic Elements/Blocks 16
Number of Macrocells 64
Number of Gates 2000
Number of I/O 64
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 100-LFBGA
Supplier Device Package 100-CABGA (10x10)
Base Product Number ISPLSI 2064VE

ISPLSI 2064VE-135LB100 Datasheet Download


ISPLSI 2064VE-135LB100 Overview



The ISPLSI 2064VE-135LB100 is a Field Programmable Gate Array (FPGA) chip designed by Lattice Semiconductor Corporation. This chip is designed for high-performance embedded systems and is suitable for a wide range of applications. It has a maximum capacity of 135,000 logic elements and can be used for a variety of applications such as industrial automation, medical imaging, aerospace and defense, automotive, and consumer electronics.


The ISPLSI 2064VE-135LB100 is a low-power, low-cost FPGA that offers high performance and scalability. It features a high-speed, low-power architecture that allows for up to 200 MHz system performance. It also features a low-power, low-noise design that reduces power consumption and noise levels.


The ISPLSI 2064VE-135LB100 has a wide range of features that make it suitable for a variety of applications. It has a flexible I/O interface that allows for up to 64 user-defined pins. It also has a high-speed, low-power memory architecture that supports up to 8K x 8K bits of RAM. It also has a built-in clock synthesizer and a high-speed, low-power DSP core.


The ISPLSI 2064VE-135LB100 is a powerful, low-cost FPGA that can be used for a variety of applications. It has a high-speed, low-power architecture, a flexible I/O interface, and a high-speed, low-power memory architecture that makes it suitable for a wide range of applications. It is a reliable and cost-effective solution for embedded systems and can be used for a variety of applications such as industrial automation, medical imaging, aerospace and defense, automotive, and consumer electronics.



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