ISPLSI 2032VE-135LJ44
ISPLSI 2032VE-135LJ44
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rohs

Lattice Semiconductor Corporation

ISPLSI 2032VE-135LJ44


ISPLSI 2032VE-135LJ44
F11-ISPLSI 2032VE-135LJ44
Active
IC CPLD 32MC 7.5NS 44PLCC
44-PLCC (16.59x16.59)

ISPLSI 2032VE-135LJ44 ECAD Model


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ISPLSI 2032VE-135LJ44 Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispLSI® 2000VE
Package Tube
Programmable Type In System Programmable
Delay Time tpd(1) Max 7.5 ns
Voltage Supply - Internal 3V ~ 3.6V
Number of Logic Elements/Blocks 8
Number of Macrocells 32
Number of Gates 1000
Number of I/O 32
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 44-LCC (J-Lead)
Supplier Device Package 44-PLCC (16.59x16.59)
Base Product Number ISPLSI 2032VE

ISPLSI 2032VE-135LJ44 Datasheet Download


ISPLSI 2032VE-135LJ44 Overview



The ISPLSI 2032VE-135LJ44 is a field-programmable gate array (FPGA) chip manufactured by Lattice Semiconductor. It is a low-cost, high-performance device designed for a wide range of applications.


The ISPLSI 2032VE-135LJ44 is a high-density FPGA with a total of 135,000 logic elements and 1.8 million system gates. It features a 4-input look-up table (LUT) architecture and a high-speed, low-power static random access memory (SRAM) block. The device also has a built-in phase-locked loop (PLL) for clock generation and control.


The ISPLSI 2032VE-135LJ44 is suitable for a variety of applications, including digital signal processing (DSP), system-on-chip (SoC) design, embedded control, and video processing. It offers high-speed, low-power operation and can be used in a wide range of applications, from consumer electronics to industrial automation.


The ISPLSI 2032VE-135LJ44 is available in a variety of packages, including a 44-pin TQFP, a 144-pin BGA, and a 144-pin LQFP. It is rated for operation at temperatures from -40°C to +85°C and is compliant with the RoHS directive.


Overall, the ISPLSI 2032VE-135LJ44 is a low-cost, high-performance FPGA chip that is suitable for a wide range of applications, from consumer electronics to industrial automation. It offers a high-density design, high-speed operation, and low-power consumption.



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