ISPLSI 2032A-80LTN48I
ISPLSI 2032A-80LTN48I
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Lattice Semiconductor Corporation

ISPLSI 2032A-80LTN48I


ISPLSI 2032A-80LTN48I
F11-ISPLSI 2032A-80LTN48I
Active
IC CPLD 32MC 15NS 48TQFP
48-TQFP (7x7)

ISPLSI 2032A-80LTN48I ECAD Model


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ISPLSI 2032A-80LTN48I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispLSI® 2000A
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 15 ns
Voltage Supply - Internal 4.5V ~ 5.5V
Number of Logic Elements/Blocks 8
Number of Macrocells 32
Number of Gates 1000
Number of I/O 32
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 48-LQFP
Supplier Device Package 48-TQFP (7x7)
Base Product Number ISPLSI 2032A

ISPLSI 2032A-80LTN48I Datasheet Download


ISPLSI 2032A-80LTN48I Overview



The ISPLSI 2032A-80LTN48I is a field programmable gate array (FPGA) chip manufactured by Lattice Semiconductor. It is a high-performance FPGA with a capacity of up to 80,000 logic elements and a maximum operating frequency of 200 MHz. It is based on the LatticeXP2 architecture, which offers high-speed routing and low power consumption.


The ISPLSI 2032A-80LTN48I is a 3.3V device that is packaged in a 48-pin plastic leaded chip carrier (PLCC). It has a total of 48 I/O pins that can be configured for various functions, such as general-purpose I/O, LVTTL, LVCMOS, and differential I/O. The chip also includes two dedicated clock pins and an I/O bank select pin.


The ISPLSI 2032A-80LTN48I is suitable for a wide range of applications, including embedded systems, industrial control, telecommunications, and automotive. It is designed for use in harsh environments, such as high-temperature operation and radiation-tolerant applications. It is also suitable for high-speed data processing and logic operations.


In summary, the ISPLSI 2032A-80LTN48I is a high-performance FPGA chip with a capacity of up to 80,000 logic elements and a maximum operating frequency of 200 MHz. It is suitable for a wide range of applications, including embedded systems, industrial control, telecommunications, and automotive. It is designed for use in harsh environments, such as high-temperature operation and radiation-tolerant applications.



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