Intel Corporation
HC20K400FC672
HC20K400FC672 ECAD Model
HC20K400FC672 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 16640 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 1.8,1.8/3.3 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
HC20K400FC672 Datasheet Download
HC20K400FC672 Overview
The HC20K400FC672 chip model is a powerful and versatile integrated circuit that offers a wide range of features and benefits. It is designed to meet the needs of a variety of industries and applications, including communications, automotive, medical, and industrial. This chip model is designed to provide superior performance, reliability, and scalability.
The HC20K400FC672 chip model is based on a 32-bit RISC architecture and is capable of delivering high-speed data processing and communication. It is designed to be highly efficient and power-efficient, with a low power consumption profile. This chip model is also designed to be highly reliable and secure, with built-in error correction and security features.
The HC20K400FC672 chip model offers a wide range of features and benefits, including high-speed data processing, low power consumption, and high reliability. It also provides superior scalability and flexibility, allowing it to be used in a variety of applications. This chip model is also designed to be highly compatible with other chips and components, allowing it to be used in advanced communication systems.
The HC20K400FC672 chip model is expected to be in high demand in the coming years, as it is suitable for a wide range of applications. Its superior performance and scalability make it ideal for use in a variety of industries, including automotive, medical, and industrial. Additionally, its low power consumption and high reliability make it a great choice for use in advanced communication systems.
The product description of the HC20K400FC672 chip model includes its 32-bit RISC architecture, high-speed data processing performance, low power consumption, and high reliability. It also provides superior scalability and flexibility, allowing it to be used in a variety of applications. Additionally, its compatibility with other chips and components makes it ideal for use in advanced communication systems.
Actual case studies have found that the HC20K400FC672 chip model is highly reliable and secure, with built-in error correction and security features. Additionally, its low power consumption and high reliability make it a great choice for use in advanced communication systems.
When using the HC20K400FC672 chip model, it is important to take into account its design requirements and specifications. Additionally, it is important to consider the possibility of future upgrades and whether the chip model can be used in advanced communication systems. It is also important to consider the chip model's compatibility with other chips and components, as well as its scalability and flexibility.
In conclusion, the HC20K400FC672 chip model is a powerful and versatile integrated circuit that offers a wide range of features and benefits. It is designed to meet the needs of a variety of industries and applications, including communications, automotive, medical, and industrial. This chip model is designed to provide superior performance, reliability, and scalability. It is expected to be in high demand in the coming years, as it is suitable for a wide range of applications. Additionally, its low power consumption and high reliability make it a great choice for use in advanced communication systems. It is important to take into account its design requirements and specifications, as well as the possibility of future upgrades and compatibility with other chips and components.
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