HC1S40F780
HC1S40F780
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rohs

Intel Corporation

HC1S40F780


HC1S40F780
F18-HC1S40F780
Active
IC FPGA 613 I/O 780FBGA
780-FBGA (29x29)

HC1S40F780 ECAD Model


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HC1S40F780 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Transferred
Number of Inputs 613
Number of Outputs 613
Number of Logic Cells 41250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Power Supplies 1.5,1.5/3.3 V
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA780,28X28,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

HC1S40F780 Overview



The chip model HC1S40F780 is a highly advanced integrated circuit (IC) designed for use in a variety of applications. It is a single-chip solution that provides high performance, low power consumption, and a wide range of features for the most demanding applications. This makes the HC1S40F780 an ideal choice for a wide range of applications, from consumer electronics to industrial control systems.


The HC1S40F780 is equipped with an array of features that make it suitable for a variety of applications. It has a wide range of features such as a low-power consumption design, high-speed operation, and a flexible architecture that allows for customization. It also has an integrated power management unit that can be used to reduce power consumption and extend battery life.


The HC1S40F780 is also designed to be highly reliable and durable. It is designed to withstand extreme temperatures, shock, and vibration, making it suitable for a variety of environments. In addition, the chip is designed to be resistant to ESD and other electrical disturbances, ensuring that the chip will remain operational even in the most challenging environments.


In terms of industry trends, the demand for the HC1S40F780 is expected to increase in the future. This is due to its wide range of features and its ability to handle a variety of applications. The chip is also expected to be used in a variety of industries, from consumer electronics to industrial control systems. This will lead to increased demand for the chip in the future.


When it comes to the application environment, the HC1S40F780 may require the support of new technologies. For example, if the application requires a high degree of accuracy, the chip may require the support of advanced algorithms. If the application requires a high degree of speed, the chip may require the support of advanced processors. In addition, the chip may require the support of advanced memory technologies in order to ensure that the chip can handle large amounts of data.


In terms of product description, the HC1S40F780 is a highly advanced and powerful chip. It is designed to be highly reliable and durable and is suitable for a variety of applications. In addition, the chip is designed to be resistant to ESD and other electrical disturbances, ensuring that the chip will remain operational even in the most challenging environments.


Finally, when it comes to actual case studies and precautions, it is important to note that the chip should be used in accordance with the manufacturer's specifications and guidelines. In addition, it is important to ensure that the chip is properly installed and that all necessary precautions are taken to ensure that the chip is operating correctly. It is also important to ensure that the chip is not exposed to extreme temperatures, shock, or vibration, as this could damage the chip. Additionally, it is important to ensure that the chip is not exposed to ESD or other electrical disturbances. Finally, it is important to ensure that the chip is properly maintained in order to ensure optimal performance.



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