Intel Corporation
HC1S30F780
HC1S30F780 ECAD Model
HC1S30F780 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Number of Inputs | 597 | |
| Number of Outputs | 597 | |
| Number of Logic Cells | 32470 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Power Supplies | 1.5,1.5/3.3 V | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA780,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
HC1S30F780 Datasheet Download
HC1S30F780 Overview
The chip model HC1S30F780 is a high-performance, low-power system on chip (SoC) designed to meet the needs of the modern connected world. It is a multi-core processor that combines a powerful ARM Cortex-A9 processor with a range of advanced features, including support for high-speed communications, multimedia processing, and high-performance graphics. With its high performance and low power consumption, the HC1S30F780 is ideal for embedded applications, such as networked home appliances, connected cars, and more.
The HC1S30F780 is designed to be easily integrated into a wide range of applications and environments, offering a flexible and cost-effective solution for system designers. It supports a variety of communication protocols, such as Ethernet, Wi-Fi, Bluetooth, and Zigbee, and can be used in both wired and wireless networks. It also supports a range of multimedia codecs, including H.264, MPEG-4, and VC-1, and can be used for audio and video streaming.
As the Internet of Things (IoT) continues to grow, the HC1S30F780 is well-positioned to take advantage of the opportunities presented by the connected world. The chip is capable of supporting the latest intelligent scenarios, such as voice recognition, machine learning, and artificial intelligence. It can also be used in the era of fully intelligent systems, allowing it to be used in a wide range of applications, such as smart home systems, intelligent transportation systems, and connected healthcare.
When designing a system that uses the HC1S30F780, it is important to consider the product’s specific design requirements. The chip is designed to operate at a wide range of temperatures, from -40°C to +85°C, and its power consumption is relatively low, making it suitable for battery-powered applications. It also supports a range of operating systems, including Android, Linux, and Windows, and can be used with a variety of development tools.
By looking at actual case studies and customer feedback, it is possible to gain an understanding of how the HC1S30F780 can be used in different applications. For example, it has been used in smart home systems to enable voice control and automated lighting, as well as in connected cars to enable navigation and infotainment systems. It has also been used in medical devices to enable remote patient monitoring and health data collection.
When using the HC1S30F780, it is important to consider the potential risks and precautions that need to be taken. As the chip is designed for use in connected systems, it is important to ensure that the system is secure and that any data collected is treated with the appropriate level of security. Additionally, it is important to ensure that the system is designed to be reliable and robust, as any failure could have serious consequences.
Overall, the HC1S30F780 is a powerful and versatile system on chip that is capable of supporting a wide range of applications and environments. Its high performance and low power consumption make it ideal for embedded applications, while its ability to support the latest intelligent scenarios makes it suitable for the era of fully intelligent systems. When designing a system that uses the HC1S30F780, it is important to consider the product’s specific design requirements and potential risks, as well as looking at actual case studies and customer feedback.
