Intel Corporation
EPF81500AQC240-3N
EPF81500AQC240-3N ECAD Model
EPF81500AQC240-3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 1.8 ns | |
| Number of Inputs | 181 | |
| Number of Outputs | 181 | |
| Number of Logic Cells | 1296 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 181 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 181 I/O | |
| Additional Feature | CAN ALSO OPERATE AT 5V SUPPLY | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3,3.3/5,5 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FQFP, QFP240,1.3SQ,20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF81500AQC240-3N Datasheet Download
EPF81500AQC240-3N Overview
The EPF81500AQC240-3N is a powerful chip model developed by Altera Corporation and is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language and offers a variety of advantages when compared to other chip models. Its design requirements are specific and require careful planning and execution.
The EPF81500AQC240-3N is a high-performance chip model that is ideal for a variety of applications. It is designed with a high-level of integration and features a low-power consumption design, making it suitable for use in a range of industrial settings. It is capable of handling complex digital signal processing tasks, as well as embedded processing and image processing. The chip model is also capable of handling a range of communication protocols, such as Ethernet, USB, and Serial ATA.
The EPF81500AQC240-3N is designed with a high-level of integration, which makes it suitable for a variety of applications. It is designed with an advanced memory architecture, which allows it to store and process data quickly and efficiently. It also features a low-power consumption design, making it ideal for use in a range of industrial settings. The chip model is also capable of handling a range of communication protocols, such as Ethernet, USB, and Serial ATA.
The EPF81500AQC240-3N requires the use of HDL language for programming and design. HDL is a hardware description language that is used to create a digital circuit design. It is a powerful language that allows for the creation of complex digital circuits and systems. The chip model also requires careful planning and execution of the design. This includes the selection of components and the implementation of the design.
The EPF81500AQC240-3N is an excellent choice for a variety of applications and is expected to be in high demand in the future. It is a powerful chip model that offers a variety of advantages compared to other chip models. Its design requirements are specific and require careful planning and execution. There are a number of case studies available that detail the design and implementation of the chip model, as well as provide guidance and tips on how to best utilize it.
Overall, the EPF81500AQC240-3N is an excellent choice for a variety of applications and is expected to be in high demand in the future. It is a powerful chip model that offers a variety of advantages compared to other chip models. Its design requirements are specific and require careful planning and execution. There are a number of case studies available that detail the design and implementation of the chip model, as well as provide guidance and tips on how to best utilize it.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||