EPF6024AFC256-2
EPF6024AFC256-2
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rohs

Intel Corporation

EPF6024AFC256-2


EPF6024AFC256-2
F18-EPF6024AFC256-2
Active
LOADABLE PLD, CMOS, BGA, BGA256,16X16,40
BGA, BGA256,16X16,40

EPF6024AFC256-2 ECAD Model


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EPF6024AFC256-2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 219
Number of Outputs 219
Number of Logic Cells 1960
Number of Dedicated Inputs 4
Number of I/O Lines 219
Programmable Logic Type LOADABLE PLD
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 219 I/O
Clock Frequency-Max 153 MHz
Output Function MACROCELL
Power Supplies 2.5/3.3,3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA256,16X16,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

EPF6024AFC256-2 Datasheet Download


EPF6024AFC256-2 Overview



The EPF6024AFC256-2 chip model is a powerful and efficient system-on-chip (SoC) designed for embedded applications. It is a single-chip solution that combines a high-performance CPU, extensive memory, and a wide range of peripherals. This makes it a great choice for embedded applications that require high computing performance and low power consumption.


The EPF6024AFC256-2 chip model has a number of advantages that make it an attractive choice for many industries. It is extremely power efficient, allowing for long battery life and low heat dissipation. It is also highly scalable, so it can easily be scaled up or down to fit the needs of a particular application. Additionally, the chip model is highly configurable, allowing for custom peripherals to be added to the system.


The expected demand for the EPF6024AFC256-2 chip model in related industries is expected to grow in the future. This is due to its powerful features, scalability, and flexibility. As more and more embedded applications require high performance and low power consumption, the EPF6024AFC256-2 chip model will become increasingly popular.


The EPF6024AFC256-2 chip model can be used in a variety of network applications, as well as in intelligent scenarios. It is possible to use the chip model in the era of fully intelligent systems, as it can be used to control complex systems and provide the necessary intelligence. Additionally, it can be used to develop and popularize future intelligent robots, as it provides a powerful platform for controlling robotic systems.


Using the EPF6024AFC256-2 chip model effectively requires specialized technical talents. This includes knowledge of embedded systems and programming, as well as an understanding of the chip model's features and capabilities. Additionally, knowledge of network protocols and robotics can be beneficial when working with the chip model. With the right skills and knowledge, the EPF6024AFC256-2 chip model can be used to create powerful and efficient embedded systems.



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Unit Price: $11.6551
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Pricing (USD)

QTY Unit Price Ext Price
1+ $10.8392 $10.8392
10+ $10.7227 $107.2269
100+ $10.1399 $1,013.9937
1000+ $9.5572 $4,778.5910
10000+ $8.7413 $8,741.3250
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