
Intel Corporation
EPF6024AFC256-2
EPF6024AFC256-2 ECAD Model
EPF6024AFC256-2 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 219 | |
Number of Outputs | 219 | |
Number of Logic Cells | 1960 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 219 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 219 I/O | |
Clock Frequency-Max | 153 MHz | |
Output Function | MACROCELL | |
Power Supplies | 2.5/3.3,3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA256,16X16,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
EPF6024AFC256-2 Datasheet Download
EPF6024AFC256-2 Overview
The EPF6024AFC256-2 chip model is a powerful and efficient system-on-chip (SoC) designed for embedded applications. It is a single-chip solution that combines a high-performance CPU, extensive memory, and a wide range of peripherals. This makes it a great choice for embedded applications that require high computing performance and low power consumption.
The EPF6024AFC256-2 chip model has a number of advantages that make it an attractive choice for many industries. It is extremely power efficient, allowing for long battery life and low heat dissipation. It is also highly scalable, so it can easily be scaled up or down to fit the needs of a particular application. Additionally, the chip model is highly configurable, allowing for custom peripherals to be added to the system.
The expected demand for the EPF6024AFC256-2 chip model in related industries is expected to grow in the future. This is due to its powerful features, scalability, and flexibility. As more and more embedded applications require high performance and low power consumption, the EPF6024AFC256-2 chip model will become increasingly popular.
The EPF6024AFC256-2 chip model can be used in a variety of network applications, as well as in intelligent scenarios. It is possible to use the chip model in the era of fully intelligent systems, as it can be used to control complex systems and provide the necessary intelligence. Additionally, it can be used to develop and popularize future intelligent robots, as it provides a powerful platform for controlling robotic systems.
Using the EPF6024AFC256-2 chip model effectively requires specialized technical talents. This includes knowledge of embedded systems and programming, as well as an understanding of the chip model's features and capabilities. Additionally, knowledge of network protocols and robotics can be beneficial when working with the chip model. With the right skills and knowledge, the EPF6024AFC256-2 chip model can be used to create powerful and efficient embedded systems.
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4,007 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $10.8392 | $10.8392 |
10+ | $10.7227 | $107.2269 |
100+ | $10.1399 | $1,013.9937 |
1000+ | $9.5572 | $4,778.5910 |
10000+ | $8.7413 | $8,741.3250 |
The price is for reference only, please refer to the actual quotation! |