
Intel Corporation
EPF6016AFC256-1
EPF6016AFC256-1 ECAD Model
EPF6016AFC256-1 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 171 | |
Number of Outputs | 171 | |
Number of Logic Cells | 1320 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 171 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 171 I/O | |
Clock Frequency-Max | 172 MHz | |
Output Function | MACROCELL | |
Power Supplies | 2.5/3.3,3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA256,16X16,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EPF6016AFC256-1 Datasheet Download
EPF6016AFC256-1 Overview
The chip model EPF6016AFC256-1 is a powerful and versatile integrated circuit that is capable of providing a wide range of functionalities for various applications. It is a field programmable gate array (FPGA) that is designed to be used in a wide variety of embedded systems and applications. This model is specifically designed for use in the embedded systems and applications that require a high level of performance and flexibility.
The industry trends of the chip model EPF6016AFC256-1 can be seen in its increasing popularity in the embedded systems and applications. This model is capable of providing a wide range of functionalities, including high-speed interconnects, memory and peripherals, and a wide range of programmable logic. It is also capable of providing a wide range of connectivity options, including Ethernet, USB, and PCIe. Moreover, it is capable of providing a wide range of power management and clock management capabilities.
In terms of future development, the chip model EPF6016AFC256-1 is expected to be used in a wide range of intelligent scenarios. As the demand for intelligent systems increases, the chip model EPF6016AFC256-1 is expected to be used in a wide range of applications, including autonomous vehicles, artificial intelligence, and the Internet of Things. Additionally, the chip model EPF6016AFC256-1 is expected to be used in the era of fully intelligent systems, as the demand for intelligent systems increases.
Regarding the product description and specific design requirements of the chip model EPF6016AFC256-1, it is important to note that this model is designed to be used in a wide range of embedded systems and applications. It is designed to provide a wide range of functionalities, including high-speed interconnects, memory and peripherals, and a wide range of programmable logic. Additionally, it is designed to provide a wide range of connectivity options, including Ethernet, USB, and PCIe. Moreover, it is capable of providing a wide range of power management and clock management capabilities.
When it comes to actual case studies and precautions, it is important to note that the chip model EPF6016AFC256-1 is designed to be used in a wide range of embedded systems and applications. As such, it is important to ensure that the design requirements are met. Additionally, it is important to ensure that the chip model EPF6016AFC256-1 is properly tested and evaluated before it is used in any application. Finally, it is important to ensure that the chip model EPF6016AFC256-1 is properly maintained and updated on a regular basis.
In conclusion, the chip model EPF6016AFC256-1 is a powerful and versatile integrated circuit that is capable of providing a wide range of functionalities for various applications. Its increasing popularity in the embedded systems and applications is indicative of its industry trends, and its expected use in a wide range of intelligent scenarios is indicative of its future development. With regards to its product description, specific design requirements, actual case studies, and precautions, it is important to ensure that the design requirements are met, that the chip model EPF6016AFC256-1 is properly tested and evaluated before use, and that it is properly maintained and updated on a regular basis.
You May Also Be Interested In
5,498 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $40.4678 | $40.4678 |
10+ | $40.0327 | $400.3270 |
100+ | $37.8570 | $3,785.7006 |
1000+ | $35.6813 | $17,840.6580 |
10000+ | $32.6354 | $32,635.3500 |
The price is for reference only, please refer to the actual quotation! |