Intel Corporation
EPF10K50STC144-1X
EPF10K50STC144-1X ECAD Model
EPF10K50STC144-1X Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 300 ps | |
| Number of Inputs | 102 | |
| Number of Outputs | 102 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 102 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 102 I/O | |
| Output Function | MIXED | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LFQFP, QFP144,.87SQ,20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K50STC144-1X Datasheet Download
EPF10K50STC144-1X Overview
The chip model EPF10K50STC144-1X is a powerful and versatile chip that is suitable for various applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it an ideal choice for those looking for a reliable and efficient solution for their needs.
The EPF10K50STC144-1X chip model has many advantages, such as its low power consumption, high-speed operation, and flexibility. It is also highly reliable and can be used in a wide range of applications. As such, it is expected to become increasingly popular in the future.
In terms of industry trends, the EPF10K50STC144-1X chip model is likely to be used in a variety of industries. For example, it could be used in the automotive, medical, and aerospace industries, as well as in consumer electronics and industrial automation. It is also likely to become increasingly popular in the Internet of Things (IoT) sector, as it is well-suited for use in connected devices.
The application environment for the EPF10K50STC144-1X chip model may require the support of new technologies. For example, it may need to be used with a high-speed communication protocol, such as Ethernet or USB. It may also need to be used with a high-speed processor, such as an ARM processor. Additionally, it may need to be used with a powerful graphics processor, such as a GPU.
In conclusion, the chip model EPF10K50STC144-1X is a powerful and versatile chip that is suitable for various applications. It is expected to become increasingly popular in the future, as it offers many advantages and can be used in a wide range of industries. It may require the support of new technologies in order to be used in its intended application environment, but this will depend on what specific technologies are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||