Intel Corporation
EPF10K50STC144-1
EPF10K50STC144-1 ECAD Model
EPF10K50STC144-1 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 300 ps | |
| Number of Inputs | 102 | |
| Number of Outputs | 102 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 102 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 102 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LFQFP, QFP144,.87SQ,20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K50STC144-1 Datasheet Download
EPF10K50STC144-1 Overview
The chip model EPF10K50STC144-1 is a high performance, low power field programmable gate array (FPGA) manufactured by Altera Corporation. This FPGA is designed for high performance digital signal processing, embedded processing, image processing, and other applications. It is capable of supporting up to 144K logic elements, and is designed to use the HDL (Hardware Description Language) to program the device.
The original design intention of the chip model EPF10K50STC144-1 was to provide a cost-effective solution for high performance applications. The device has been designed to be highly scalable, allowing for future upgrades and enhancements. This device is suitable for advanced communication systems, as it is capable of providing fast data transfer rates and low latency.
The product description and specific design requirements of the chip model EPF10K50STC144-1 include its ability to support up to 144K logic elements, its low power consumption, and its support for the HDL language. Additionally, the device features a high-speed serial interface, which enables it to be used in high-speed communication systems. The device is also capable of supporting multiple clock frequencies, which allows for increased flexibility in system design.
Case studies and precautions should be taken when using the chip model EPF10K50STC144-1. As the device is designed for high performance applications, it is important to ensure that the correct HDL code is used to program the device. Additionally, it is important to ensure that the device is properly cooled, as overheating can cause the device to malfunction. Finally, it is important to ensure that the device is properly powered, as it is designed to work on a single voltage level.
In conclusion, the chip model EPF10K50STC144-1 is a high performance, low power FPGA designed for high performance digital signal processing, embedded processing, image processing, and other applications. The device is designed to be highly scalable, allowing for future upgrades and enhancements. It is important to ensure that the correct HDL code is used to program the device, and that the device is properly cooled and powered. Case studies and precautions should be taken when using the chip model EPF10K50STC144-1, as it is designed for high performance applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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