
Intel Corporation
EPF10K50SFC484-1X
EPF10K50SFC484-1X ECAD Model
EPF10K50SFC484-1X Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 300 ps | |
Number of Inputs | 254 | |
Number of Outputs | 254 | |
Number of Logic Cells | 2880 | |
Number of I/O Lines | 254 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 254 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484 | |
Pin Count | 484 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D | |
Samacsys Manufacturer | Intel |
EPF10K50SFC484-1X Overview
The chip model EPF10K50SFC484-1X is a highly versatile and powerful integrated circuit that has been developed by a leading manufacturer of integrated circuits. This model is designed to be used in a wide range of applications, including the development of high-end communication systems and the creation of intelligent robots. It is a cutting-edge technology that offers a variety of advantages over other products on the market.
The EPF10K50SFC484-1X chip model is capable of being used in a variety of applications, including high-speed communication systems, digital signal processing, and embedded systems. It has a low power consumption rate and a wide operating temperature range, making it an excellent choice for many applications. The chip model is also designed with advanced features such as powerful data processing capabilities, fast clock speeds, and advanced security features.
The EPF10K50SFC484-1X chip model is expected to experience an increase in demand in the future, as it is increasingly being used in a variety of applications. The chip model is already being used in the development of high-end communication systems and the creation of intelligent robots, and its demand is expected to increase further in the coming years. As the demand for this chip model increases, the manufacturer will likely continue to upgrade the chip model in order to keep up with the ever-changing technology landscape.
The EPF10K50SFC484-1X chip model is capable of being used in the development and popularization of future intelligent robots. This chip model is designed to be used in a variety of applications, and its advanced features make it an excellent choice for the development of robots. In order to use this chip model effectively, however, it is important to have a good understanding of the technical aspects of the chip model, as well as the programming languages and hardware that are required to use the chip model effectively.
In conclusion, the chip model EPF10K50SFC484-1X is a powerful and versatile integrated circuit that is designed to be used in a variety of applications. It has a low power consumption rate and a wide operating temperature range, making it an excellent choice for many applications. The chip model is expected to experience an increase in demand in the future, as it is increasingly being used in a variety of applications. It is also capable of being used in the development and popularization of future intelligent robots, although its effective use requires a good understanding of the technical aspects of the chip model, as well as the programming languages and hardware that are required to use the chip model effectively.
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