EPF10K50SFC484-1X
EPF10K50SFC484-1X
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rohs

Intel Corporation

EPF10K50SFC484-1X


EPF10K50SFC484-1X
F18-EPF10K50SFC484-1X
Active
IC FPGA 220 I/O 484FBGA
484-FBGA (23x23)

EPF10K50SFC484-1X ECAD Model


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EPF10K50SFC484-1X Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 2.5 V
Propagation Delay 300 ps
Number of Inputs 254
Number of Outputs 254
Number of Logic Cells 2880
Number of I/O Lines 254
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 254 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484
Pin Count 484
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D
Samacsys Manufacturer Intel

EPF10K50SFC484-1X Overview



The chip model EPF10K50SFC484-1X is a highly versatile and powerful integrated circuit that has been developed by a leading manufacturer of integrated circuits. This model is designed to be used in a wide range of applications, including the development of high-end communication systems and the creation of intelligent robots. It is a cutting-edge technology that offers a variety of advantages over other products on the market.


The EPF10K50SFC484-1X chip model is capable of being used in a variety of applications, including high-speed communication systems, digital signal processing, and embedded systems. It has a low power consumption rate and a wide operating temperature range, making it an excellent choice for many applications. The chip model is also designed with advanced features such as powerful data processing capabilities, fast clock speeds, and advanced security features.


The EPF10K50SFC484-1X chip model is expected to experience an increase in demand in the future, as it is increasingly being used in a variety of applications. The chip model is already being used in the development of high-end communication systems and the creation of intelligent robots, and its demand is expected to increase further in the coming years. As the demand for this chip model increases, the manufacturer will likely continue to upgrade the chip model in order to keep up with the ever-changing technology landscape.


The EPF10K50SFC484-1X chip model is capable of being used in the development and popularization of future intelligent robots. This chip model is designed to be used in a variety of applications, and its advanced features make it an excellent choice for the development of robots. In order to use this chip model effectively, however, it is important to have a good understanding of the technical aspects of the chip model, as well as the programming languages and hardware that are required to use the chip model effectively.


In conclusion, the chip model EPF10K50SFC484-1X is a powerful and versatile integrated circuit that is designed to be used in a variety of applications. It has a low power consumption rate and a wide operating temperature range, making it an excellent choice for many applications. The chip model is expected to experience an increase in demand in the future, as it is increasingly being used in a variety of applications. It is also capable of being used in the development and popularization of future intelligent robots, although its effective use requires a good understanding of the technical aspects of the chip model, as well as the programming languages and hardware that are required to use the chip model effectively.



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