
Intel Corporation
EPF10K50SBC356-3
EPF10K50SBC356-3 ECAD Model
EPF10K50SBC356-3 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 500 ps | |
Number of Inputs | 220 | |
Number of Outputs | 220 | |
Number of Logic Cells | 2880 | |
Number of I/O Lines | 220 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 220 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B356 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 356 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA356,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.63 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | LBGA, BGA356,26X26,50 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
EPF10K50SBC356-3 Datasheet Download
EPF10K50SBC356-3 Overview
The chip model EPF10K50SBC356-3 is a powerful device that has been gaining traction in the semiconductor industry. It is a field-programmable gate array (FPGA) that has a wide range of applications, from consumer electronics to industrial and medical devices. This chip model is designed to provide high performance, low power consumption, and easy integration into various systems.
The EPF10K50SBC356-3 has several advantages that make it an attractive choice for many applications. It has a high speed, low power consumption, and low cost, making it an ideal option for many industries. Additionally, it is highly programmable, allowing for custom designs and applications. It also has a built-in debug feature, making it easy to troubleshoot and debug.
In terms of future industry trends, the EPF10K50SBC356-3 is expected to remain a popular choice for many applications. It is expected to be used in a variety of applications, from consumer electronics to industrial and medical devices. Additionally, it is expected to be used in a variety of IoT devices and other embedded systems.
The product description and design requirements of the EPF10K50SBC356-3 can be found in the product datasheet. This datasheet provides detailed information about the chip's features, design requirements, and performance. It also provides guidance on proper usage, safety, and maintenance. Additionally, the datasheet provides a detailed description of the specific design requirements that must be met in order to ensure proper operation.
In addition to the product datasheet, there are several case studies that can provide insight into the use of the EPF10K50SBC356-3. These case studies can provide useful information about the performance, reliability, and cost-effectiveness of the chip model. Additionally, these case studies can provide insight into the potential applications of the chip model and the potential benefits it can provide.
Finally, there are several precautions that should be taken when using the EPF10K50SBC356-3. It is important to ensure that the chip model is properly installed, configured, and maintained. Additionally, it is important to ensure that the chip model is used in the appropriate environment and that the proper safety measures are taken.
In conclusion, the EPF10K50SBC356-3 is a powerful device that has a wide range of applications. It has several advantages that make it an attractive choice for many industries, and it is expected to remain a popular choice in the future. The product datasheet and case studies can provide insight into the use of the chip model, and it is important to ensure that the chip model is properly installed, configured, and maintained.
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2,891 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $173.0834 | $173.0834 |
10+ | $171.2223 | $1,712.2230 |
100+ | $161.9167 | $16,191.6744 |
1000+ | $152.6112 | $76,305.5920 |
10000+ | $139.5834 | $139,583.4000 |
The price is for reference only, please refer to the actual quotation! |