Intel Corporation
EPF10K50SBC356-2X
EPF10K50SBC356-2X ECAD Model
EPF10K50SBC356-2X Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 400 ps | |
| Number of Inputs | 220 | |
| Number of Outputs | 220 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 220 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 220 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, BGA356,26X26,50 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K50SBC356-2X Datasheet Download
EPF10K50SBC356-2X Overview
The chip model EPF10K50SBC356-2X is a high-performance digital signal processing solution designed for embedded processing, image processing, and other applications. It is designed to be programmed using HDL language, making it suitable for a wide range of applications.
The chip model EPF10K50SBC356-2X is designed to meet the needs of today’s high-performance digital signal processing and embedded processing requirements. It is designed to be easily upgradable, allowing for future expansion and development as needed. With its robust architecture, the chip model EPF10K50SBC356-2X is also suitable for advanced communication systems.
The chip model EPF10K50SBC356-2X is designed to keep up with industry trends and to be able to support new technologies as needed. As the technology landscape continues to evolve, the chip model EPF10K50SBC356-2X is designed to remain current and able to support the latest advancements. By continuously updating its architecture, the chip model EPF10K50SBC356-2X can remain a viable option for digital signal processing and embedded processing applications.
The chip model EPF10K50SBC356-2X is an ideal solution for digital signal processing, embedded processing and image processing applications. It is designed to be easily upgradable and to support new technologies as needed. With its robust architecture, the chip model EPF10K50SBC356-2X is also suitable for advanced communication systems. By keeping up with industry trends, the chip model EPF10K50SBC356-2X can remain a viable option for digital signal processing and embedded processing applications.
You May Also Be Interested In
4,887 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $244.6049 | $244.6049 |
| 10+ | $241.9747 | $2,419.7472 |
| 100+ | $228.8239 | $22,882.3920 |
| 1000+ | $215.6731 | $107,836.5600 |
| 10000+ | $197.2620 | $197,262.0000 |
| The price is for reference only, please refer to the actual quotation! | ||