
Intel Corporation
EPF10K50SBC356-2
EPF10K50SBC356-2 ECAD Model
EPF10K50SBC356-2 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 400 ps | |
Number of Inputs | 220 | |
Number of Outputs | 220 | |
Number of Logic Cells | 2880 | |
Number of I/O Lines | 220 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 220 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B356 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 356 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA356,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.63 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | LBGA, BGA356,26X26,50 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
EPF10K50SBC356-2 Datasheet Download
EPF10K50SBC356-2 Overview
The chip model EPF10K50SBC356-2 is a highly advanced semiconductor device that has been gaining popularity in the industry for its excellent performance and reliability. It is a high-performance, low-power, and cost-effective solution for a wide range of applications. This chip model is widely used in consumer electronics, automotive, industrial, medical, and communications markets.
The EPF10K50SBC356-2 is a low-power, high-performance, and low-cost chip model. It is designed to provide high-speed data transfer and reliable performance. The chip model features a high-speed data transfer rate of up to 10 gigabits per second, which is ideal for applications such as high-speed data transmission, high-definition video streaming, and multimedia applications. It also features low power consumption and low thermal dissipation. This chip model is also designed to be compatible with a wide range of operating systems and devices.
The EPF10K50SBC356-2 is a highly advanced chip model that is designed to meet the needs of various applications. It is designed to provide a reliable and cost-effective solution for a wide range of applications. The chip model features a high-speed data transfer rate of up to 10 gigabits per second, which is ideal for applications such as high-speed data transmission, high-definition video streaming, and multimedia applications. It also features low power consumption and low thermal dissipation. This chip model is also designed to be compatible with a wide range of operating systems and devices.
The EPF10K50SBC356-2 is expected to be in high demand in the future due to its excellent performance and reliability. This chip model is also expected to be used in a wide range of applications, including consumer electronics, automotive, industrial, medical, and communications markets. The chip model is also expected to be used in applications that require high-speed data transfer and reliable performance.
The product description and specific design requirements of the chip model EPF10K50SBC356-2 are designed to provide a reliable and cost-effective solution for a wide range of applications. The chip model features a high-speed data transfer rate of up to 10 gigabits per second, which is ideal for applications such as high-speed data transmission, high-definition video streaming, and multimedia applications. It also features low power consumption and low thermal dissipation. The chip model is also designed to be compatible with a wide range of operating systems and devices.
In addition to the product description and design requirements of the chip model EPF10K50SBC356-2, actual case studies and precautions should be taken into consideration when using the chip model. As with any chip model, it is important to understand the specific design requirements and the environment in which the chip model will be used. This will ensure that the chip model performs as expected and is used in the most efficient and effective manner possible.
Overall, the chip model EPF10K50SBC356-2 is a highly advanced semiconductor device that is expected to be in high demand in the future due to its excellent performance and reliability. It is designed to provide a reliable and cost-effective solution for a wide range of applications. The product description and specific design requirements of the chip model should be taken into consideration when using the chip model, as well as actual case studies and precautions. Whether the application environment requires the support of new technologies will depend on what specific technologies are needed.
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4,610 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $178.0332 | $178.0332 |
10+ | $176.1189 | $1,761.1891 |
100+ | $166.5472 | $16,654.7232 |
1000+ | $156.9756 | $78,487.7760 |
10000+ | $143.5752 | $143,575.2000 |
The price is for reference only, please refer to the actual quotation! |