EPF10K50SBC356-2
EPF10K50SBC356-2
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rohs

Intel Corporation

EPF10K50SBC356-2


EPF10K50SBC356-2
F18-EPF10K50SBC356-2
Active
LOADABLE PLD, 400 ps, CMOS, LBGA, BGA356,26X26,50
LBGA, BGA356,26X26,50

EPF10K50SBC356-2 ECAD Model


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EPF10K50SBC356-2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 400 ps
Number of Inputs 220
Number of Outputs 220
Number of Logic Cells 2880
Number of I/O Lines 220
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 220 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B356
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 356
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA356,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.63 mm
Ihs Manufacturer INTEL CORP
Package Description LBGA, BGA356,26X26,50
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EPF10K50SBC356-2 Datasheet Download


EPF10K50SBC356-2 Overview



The chip model EPF10K50SBC356-2 is a highly advanced semiconductor device that has been gaining popularity in the industry for its excellent performance and reliability. It is a high-performance, low-power, and cost-effective solution for a wide range of applications. This chip model is widely used in consumer electronics, automotive, industrial, medical, and communications markets.


The EPF10K50SBC356-2 is a low-power, high-performance, and low-cost chip model. It is designed to provide high-speed data transfer and reliable performance. The chip model features a high-speed data transfer rate of up to 10 gigabits per second, which is ideal for applications such as high-speed data transmission, high-definition video streaming, and multimedia applications. It also features low power consumption and low thermal dissipation. This chip model is also designed to be compatible with a wide range of operating systems and devices.


The EPF10K50SBC356-2 is a highly advanced chip model that is designed to meet the needs of various applications. It is designed to provide a reliable and cost-effective solution for a wide range of applications. The chip model features a high-speed data transfer rate of up to 10 gigabits per second, which is ideal for applications such as high-speed data transmission, high-definition video streaming, and multimedia applications. It also features low power consumption and low thermal dissipation. This chip model is also designed to be compatible with a wide range of operating systems and devices.


The EPF10K50SBC356-2 is expected to be in high demand in the future due to its excellent performance and reliability. This chip model is also expected to be used in a wide range of applications, including consumer electronics, automotive, industrial, medical, and communications markets. The chip model is also expected to be used in applications that require high-speed data transfer and reliable performance.


The product description and specific design requirements of the chip model EPF10K50SBC356-2 are designed to provide a reliable and cost-effective solution for a wide range of applications. The chip model features a high-speed data transfer rate of up to 10 gigabits per second, which is ideal for applications such as high-speed data transmission, high-definition video streaming, and multimedia applications. It also features low power consumption and low thermal dissipation. The chip model is also designed to be compatible with a wide range of operating systems and devices.


In addition to the product description and design requirements of the chip model EPF10K50SBC356-2, actual case studies and precautions should be taken into consideration when using the chip model. As with any chip model, it is important to understand the specific design requirements and the environment in which the chip model will be used. This will ensure that the chip model performs as expected and is used in the most efficient and effective manner possible.


Overall, the chip model EPF10K50SBC356-2 is a highly advanced semiconductor device that is expected to be in high demand in the future due to its excellent performance and reliability. It is designed to provide a reliable and cost-effective solution for a wide range of applications. The product description and specific design requirements of the chip model should be taken into consideration when using the chip model, as well as actual case studies and precautions. Whether the application environment requires the support of new technologies will depend on what specific technologies are needed.



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Unit Price: $191.4336
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Pricing (USD)

QTY Unit Price Ext Price
1+ $178.0332 $178.0332
10+ $176.1189 $1,761.1891
100+ $166.5472 $16,654.7232
1000+ $156.9756 $78,487.7760
10000+ $143.5752 $143,575.2000
The price is for reference only, please refer to the actual quotation!

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