Intel Corporation
EPF10K50ETC144-3N
EPF10K50ETC144-3N ECAD Model
EPF10K50ETC144-3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 800 ps | |
| Number of Inputs | 102 | |
| Number of Outputs | 102 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 102 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 102 I/O | |
| Additional Feature | 2880 LOGIC ELEMENTS | |
| Clock Frequency-Max | 140 MHz | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LFQFP, QFP144,.63SQ,20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K50ETC144-3N Datasheet Download
EPF10K50ETC144-3N Overview
The chip model EPF10K50ETC144-3N is a high-performance digital signal processing (DSP) chip designed for embedded processing, image processing, and other applications. It is programmed using hardware description language (HDL) and is capable of handling complex operations with minimal power consumption. This makes it an ideal choice for applications that require high-speed data processing, such as digital signal processing, image processing, and embedded systems.
The future of the EPF10K50ETC144-3N chip model is likely to be closely tied to the development of new technologies. As the demand for higher performance and more efficient data processing increases, the chip model will be well-positioned to take advantage of the latest advances. It is likely that the chip model could be used in networks, intelligent systems, and other applications that require high-speed data processing.
The chip model is also well-suited for applications in the era of fully intelligent systems. It can be used to process large amounts of data quickly, making it ideal for applications such as autonomous vehicles, smart homes, and other applications that require real-time decision making. The chip model is also capable of handling complex operations with minimal power consumption, making it suitable for battery-powered applications.
The chip model EPF10K50ETC144-3N is an ideal choice for applications that require high-speed data processing. It is capable of handling complex operations with minimal power consumption and is well-suited for the development of new technologies. It can be used in networks, intelligent systems, and other applications that require high-speed data processing. The chip model is also well-suited for applications in the era of fully intelligent systems, such as autonomous vehicles and smart homes.
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1,489 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $47.4300 | $47.4300 |
| 10+ | $46.9200 | $469.2000 |
| 100+ | $44.3700 | $4,437.0000 |
| 1000+ | $41.8200 | $20,910.0000 |
| 10000+ | $38.2500 | $38,250.0000 |
| The price is for reference only, please refer to the actual quotation! | ||