EPF10K50EQC208-1N
EPF10K50EQC208-1N
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rohs

Intel Corporation

EPF10K50EQC208-1N


EPF10K50EQC208-1N
F18-EPF10K50EQC208-1N
Active
LOADABLE PLD, 500 ps, CMOS, FQFP, QFP208,1.2SQ,20
FQFP, QFP208,1.2SQ,20

EPF10K50EQC208-1N ECAD Model


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EPF10K50EQC208-1N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 500 ps
Number of Inputs 147
Number of Outputs 147
Number of Logic Cells 2880
Number of I/O Lines 147
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 147 I/O
Additional Feature 2880 LOGIC ELEMENTS
Clock Frequency-Max 140 MHz
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.3 V
JESD-30 Code S-PQFP-G208
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 208
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Equivalence Code QFP208,1.2SQ,20
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer INTEL CORP
Package Description FQFP, QFP208,1.2SQ,20
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EPF10K50EQC208-1N Datasheet Download


EPF10K50EQC208-1N Overview



The chip model EPF10K50EQC208-1N is a highly advanced integrated circuit designed to provide reliable and efficient performance for a wide range of applications. It is designed to be used in both wired and wireless communication systems, as well as in advanced communication systems. The original design intention of the chip model EPF10K50EQC208-1N was to provide a reliable and efficient communication platform for a wide range of applications.


The chip model EPF10K50EQC208-1N is capable of providing a high level of performance in both wired and wireless communication systems, as well as in advanced communication systems. It has been designed to be highly reliable and efficient, with a low power consumption and a high speed of operation. Additionally, it is capable of providing a wide range of features, including high-speed data transfer, low latency, and low error rates.


The chip model EPF10K50EQC208-1N is also capable of being upgraded in the future, allowing it to be used in more advanced communication systems. It is possible to use the chip model EPF10K50EQC208-1N in networks, and it can be used in intelligent scenarios such as the Internet of Things (IoT) and machine learning. Additionally, it is capable of being used in the era of fully intelligent systems, as it is highly reliable and efficient.


In terms of product design, the chip model EPF10K50EQC208-1N has been designed to meet the specific requirements of a wide range of applications. It has been designed to be highly reliable and efficient, with a low power consumption and a high speed of operation. Additionally, it is capable of providing a wide range of features, including high-speed data transfer, low latency, and low error rates.


The chip model EPF10K50EQC208-1N has been used in a variety of applications, and there are a number of case studies available which demonstrate its successful use in different scenarios. Additionally, there are a number of precautions which should be taken when using the chip model EPF10K50EQC208-1N. These include ensuring that all components are compatible with the chip, and that the chip is not exposed to any environmental hazards.


In conclusion, the chip model EPF10K50EQC208-1N is a highly advanced integrated circuit designed to provide reliable and efficient performance for a wide range of applications. It is capable of being upgraded in the future, allowing it to be used in more advanced communication systems. It is possible to use the chip model EPF10K50EQC208-1N in networks, and it can be used in intelligent scenarios such as the Internet of Things (IoT) and machine learning. Additionally, it is capable of being used in the era of fully intelligent systems, as it is highly reliable and efficient. It has been designed to meet the specific requirements of a wide range of applications, and there are a number of case studies available which demonstrate its successful use in different scenarios.



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