
Intel Corporation
EPF10K50EQC208-1N
EPF10K50EQC208-1N ECAD Model
EPF10K50EQC208-1N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 500 ps | |
Number of Inputs | 147 | |
Number of Outputs | 147 | |
Number of Logic Cells | 2880 | |
Number of I/O Lines | 147 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 147 I/O | |
Additional Feature | 2880 LOGIC ELEMENTS | |
Clock Frequency-Max | 140 MHz | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.3 V | |
JESD-30 Code | S-PQFP-G208 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 208 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Equivalence Code | QFP208,1.2SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FQFP, QFP208,1.2SQ,20 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EPF10K50EQC208-1N Datasheet Download
EPF10K50EQC208-1N Overview
The chip model EPF10K50EQC208-1N is a highly advanced integrated circuit designed to provide reliable and efficient performance for a wide range of applications. It is designed to be used in both wired and wireless communication systems, as well as in advanced communication systems. The original design intention of the chip model EPF10K50EQC208-1N was to provide a reliable and efficient communication platform for a wide range of applications.
The chip model EPF10K50EQC208-1N is capable of providing a high level of performance in both wired and wireless communication systems, as well as in advanced communication systems. It has been designed to be highly reliable and efficient, with a low power consumption and a high speed of operation. Additionally, it is capable of providing a wide range of features, including high-speed data transfer, low latency, and low error rates.
The chip model EPF10K50EQC208-1N is also capable of being upgraded in the future, allowing it to be used in more advanced communication systems. It is possible to use the chip model EPF10K50EQC208-1N in networks, and it can be used in intelligent scenarios such as the Internet of Things (IoT) and machine learning. Additionally, it is capable of being used in the era of fully intelligent systems, as it is highly reliable and efficient.
In terms of product design, the chip model EPF10K50EQC208-1N has been designed to meet the specific requirements of a wide range of applications. It has been designed to be highly reliable and efficient, with a low power consumption and a high speed of operation. Additionally, it is capable of providing a wide range of features, including high-speed data transfer, low latency, and low error rates.
The chip model EPF10K50EQC208-1N has been used in a variety of applications, and there are a number of case studies available which demonstrate its successful use in different scenarios. Additionally, there are a number of precautions which should be taken when using the chip model EPF10K50EQC208-1N. These include ensuring that all components are compatible with the chip, and that the chip is not exposed to any environmental hazards.
In conclusion, the chip model EPF10K50EQC208-1N is a highly advanced integrated circuit designed to provide reliable and efficient performance for a wide range of applications. It is capable of being upgraded in the future, allowing it to be used in more advanced communication systems. It is possible to use the chip model EPF10K50EQC208-1N in networks, and it can be used in intelligent scenarios such as the Internet of Things (IoT) and machine learning. Additionally, it is capable of being used in the era of fully intelligent systems, as it is highly reliable and efficient. It has been designed to meet the specific requirements of a wide range of applications, and there are a number of case studies available which demonstrate its successful use in different scenarios.
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