Intel Corporation
EPF10K50EFC484-3N
EPF10K50EFC484-3N ECAD Model
EPF10K50EFC484-3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 800 ps | |
| Number of Inputs | 254 | |
| Number of Outputs | 254 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 254 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 254 I/O | |
| Additional Feature | 2880 LOGIC ELEMENTS | |
| Clock Frequency-Max | 140 MHz | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K50EFC484-3N Datasheet Download
EPF10K50EFC484-3N Overview
The chip model EPF10K50EFC484-3N is a high-performance FPGA chip developed by Altera, a leading provider of programmable logic solutions. It is designed for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. With its high speed and low power consumption, the EPF10K50EFC484-3N is an ideal choice for many advanced applications.
The chip model EPF10K50EFC484-3N has a wide range of features and capabilities, including high-speed logic, high-speed signal processing, embedded memory, and high-speed I/O. It also has a large number of user-programmable logic elements, which allows for a wide range of custom designs. In addition, the chip model EPF10K50EFC484-3N has a built-in high-speed serial interface, which makes it suitable for applications such as high-speed data transfer and communication.
The EPF10K50EFC484-3N is suitable for a variety of applications, including digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. In addition, it can be used for the development and popularization of future intelligent robots. To use the EPF10K50EFC484-3N effectively, technical talents with a good understanding of HDL language and FPGA design are needed.
When using the EPF10K50EFC484-3N, it is important to consider the product description and specific design requirements. The user should also be aware of the actual case studies and precautions when using the chip model. This will help ensure that the chip model is used correctly and efficiently, and that the desired results are achieved.
In conclusion, the chip model EPF10K50EFC484-3N is a high-performance FPGA chip that is suitable for a variety of applications, including digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is also suitable for the development and popularization of future intelligent robots. To use the EPF10K50EFC484-3N effectively, technical talents with a good understanding of HDL language and FPGA design are needed. It is important to consider the product description and specific design requirements, as well as actual case studies and precautions when using the chip model.
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