Intel Corporation
EPF10K50EFC484-2
EPF10K50EFC484-2 ECAD Model
EPF10K50EFC484-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 600 ps | |
| Number of Inputs | 254 | |
| Number of Outputs | 254 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 254 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 254 I/O | |
| Additional Feature | 2880 LOGIC ELEMENTS | |
| Clock Frequency-Max | 140 MHz | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K50EFC484-2 Datasheet Download
EPF10K50EFC484-2 Overview
The chip model EPF10K50EFC484-2 is a highly advanced integrated circuit (IC), designed to provide high-performance digital signal processing, embedded processing, and image processing. It is suitable for a wide range of applications, including industrial automation, medical equipment, consumer electronics, and automotive systems. The model is powered by a high-performance Field Programmable Gate Array (FPGA) that enables the chip to process data quickly and accurately.
The EPF10K50EFC484-2 chip model is equipped with a powerful HDL language, which provides users with the ability to develop complex algorithms and applications. It also features a variety of digital signal processing and embedded processing capabilities, allowing users to create sophisticated systems with minimal effort. Additionally, it is capable of handling large amounts of data quickly and efficiently, making it ideal for applications that require high-speed data processing.
The EPF10K50EFC484-2 chip model is extremely versatile, allowing users to customize their applications with ease. It is also highly reliable and cost-effective, making it a popular choice among developers. Furthermore, its high-performance digital signal processing and embedded processing capabilities make it ideal for applications that require the use of advanced technologies.
The EPF10K50EFC484-2 chip model is expected to become increasingly popular in the future. Its versatility and cost-effectiveness make it a great choice for a variety of applications. Furthermore, its high-performance digital signal processing and embedded processing capabilities make it a great choice for applications that require the use of advanced technologies. Additionally, its reliability and cost-effectiveness make it an attractive option for developers who are looking for a cost-effective solution for their applications.
In conclusion, the EPF10K50EFC484-2 chip model is a powerful and versatile integrated circuit, designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It is suitable for a wide range of applications, including industrial automation, medical equipment, consumer electronics, and automotive systems. Its versatility and cost-effectiveness make it a great choice for developers who are looking for a cost-effective solution for their applications. Additionally, its high-performance digital signal processing and embedded processing capabilities make it ideal for applications that require the use of advanced technologies. It is expected to become increasingly popular in the future, due to its reliability and cost-effectiveness.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
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