Intel Corporation
EPF10K50EFC256-2N
EPF10K50EFC256-2N ECAD Model
EPF10K50EFC256-2N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 600 ps | |
| Number of Inputs | 191 | |
| Number of Outputs | 191 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 191 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 191 I/O | |
| Additional Feature | 2880 LOGIC ELEMENTS | |
| Clock Frequency-Max | 140 MHz | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K50EFC256-2N Datasheet Download
EPF10K50EFC256-2N Overview
The chip model EPF10K50EFC256-2N is a field programmable gate array (FPGA) developed by Altera Corporation, a semiconductor company. It is a highly integrated device that combines a wide range of features, including high-speed transceivers, high-performance logic, and embedded memory. It is the perfect choice for applications that require high performance and low power consumption.
The EPF10K50EFC256-2N has a wide range of features that make it suitable for multiple applications. It has a high-speed transceiver that supports up to 16 Gbps of data transfer. It also has a high-performance logic that can process up to 600 million logic elements per second. This is ideal for applications that require fast and reliable processing. Moreover, it has embedded memory that can store up to 4.5 MB of data. This makes it suitable for applications that require large amounts of data storage.
The EPF10K50EFC256-2N is designed to be highly efficient and cost-effective. It has an industry-leading power efficiency of up to 90% and an operating temperature range of -40°C to +85°C. This makes it suitable for a wide range of applications, including automotive, industrial, and consumer electronics.
The EPF10K50EFC256-2N is expected to see increasing demand in the future, as it is the perfect choice for applications that require high performance and low power consumption. It is also expected to be used in more advanced communication systems, as it is capable of providing high-speed data transfer and reliable processing.
The EPF10K50EFC256-2N is also designed to be upgradeable. The company has already released a new version of the chip, the EPF10K50EFC256-2S, which has improved performance and lower power consumption. This indicates that the EPF10K50EFC256-2N is capable of being upgraded in the future, making it suitable for use in advanced communication systems.
Overall, the chip model EPF10K50EFC256-2N is an ideal choice for applications that require high performance and low power consumption. It is expected to be increasingly used in the future, and its upgradeability makes it suitable for use in advanced communication systems. As such, it is expected to be a key component in the development of future technologies.
You May Also Be Interested In
3,048 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||