Intel Corporation
EPF10K50EFC256-2
EPF10K50EFC256-2 ECAD Model
EPF10K50EFC256-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 600 ps | |
| Number of Inputs | 191 | |
| Number of Outputs | 191 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 191 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 191 I/O | |
| Additional Feature | 2880 LOGIC ELEMENTS | |
| Clock Frequency-Max | 140 MHz | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K50EFC256-2 Datasheet Download
EPF10K50EFC256-2 Overview
The chip model EPF10K50EFC256-2 has become increasingly popular in the industry in recent years. This model is a field-programmable gate array (FPGA) chip, and it is designed to provide a low-cost, low-power solution for a variety of applications. It is suitable for embedded systems, industrial control, and other areas.
The EPF10K50EFC256-2 chip model is designed to meet the needs of the industrial market. It has a high degree of flexibility, allowing users to customize the chip with their own designs. This makes it suitable for a wide range of applications, from simple to complex. It also has a low power consumption, allowing it to be used in battery-powered devices. In addition, it is highly reliable, with a long service life.
The EPF10K50EFC256-2 chip model has become increasingly popular in the industry due to its performance, flexibility, and cost-effectiveness. As the technology continues to advance, the demand for this model is expected to continue to increase. This model is expected to be used in a variety of applications, including industrial control, embedded systems, and more.
The EPF10K50EFC256-2 chip model can also be used in the development and popularization of future intelligent robots. This chip model is capable of performing complex tasks, making it suitable for robotics applications. In order to use the model effectively, it is important to have the right technical talent. This includes engineers who understand the FPGA technology, as well as software engineers who can develop software to control the robot.
Overall, the EPF10K50EFC256-2 chip model has become a popular choice in the industry due to its performance, flexibility, and cost-effectiveness. It is expected to be used in a variety of applications, including industrial control, embedded systems, and robotics. In order to use the model effectively, it is important to have the right technical talent. With the right technology and the right people, the EPF10K50EFC256-2 chip model can be used to develop and popularize future intelligent robots.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||