Intel Corporation
EPF10K30ETI144-3
EPF10K30ETI144-3 ECAD Model
EPF10K30ETI144-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 12.5 ns | |
| Number of Inputs | 102 | |
| Number of Outputs | 102 | |
| Number of Logic Cells | 1728 | |
| Number of I/O Lines | 102 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 102 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LFQFP, QFP144,.63SQ,20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K30ETI144-3 Datasheet Download
EPF10K30ETI144-3 Overview
The EPF10K30ETI144-3 chip model is a highly advanced integrated circuit (IC) designed to meet the growing demands of the electronics industry. It is a field programmable gate array (FPGA) designed to provide the flexibility and scalability needed to meet the ever-changing needs of the industry. This chip model is a great choice for applications that require high performance, low power consumption, and a high degree of flexibility.
The EPF10K30ETI144-3 chip model is a powerful, reliable, and cost-effective solution for a variety of applications. It is equipped with a wide range of features, including high-speed signal processing, support for multiple clock domains, and a high-speed memory interface. It also features a wide range of I/O options, including LVDS, SPI, and I2C. Additionally, the chip model offers a variety of power management features, including dynamic voltage scaling and power management logic.
The EPF10K30ETI144-3 chip model is a great choice for applications that require high performance and scalability. It is used in a variety of industries, including automotive, industrial, and medical applications. It is also used in a variety of consumer electronics, including smartphones, tablets, and other mobile devices. The chip model is also used in a variety of embedded systems, including those used in the aerospace and defense industries.
The EPF10K30ETI144-3 chip model is designed to meet the needs of a variety of applications. It is designed to be highly efficient, with low power consumption and high performance. It is also designed to be highly reliable, with a high degree of flexibility. The chip model is also designed to be highly scalable, with support for multiple clock domains and a wide range of I/O options.
The EPF10K30ETI144-3 chip model is a great choice for applications that require high performance, low power consumption, and a high degree of flexibility. It is used in a variety of industries and applications, and is designed to meet the needs of a variety of applications. As the industry continues to evolve and new technologies emerge, the EPF10K30ETI144-3 chip model will continue to be a great choice for a variety of applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||