Intel Corporation
EPF10K30ETC144-1N
EPF10K30ETC144-1N ECAD Model
EPF10K30ETC144-1N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 400 ps | |
| Number of Inputs | 102 | |
| Number of Outputs | 102 | |
| Number of Logic Cells | 1728 | |
| Number of I/O Lines | 102 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 102 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LFQFP, QFP144,.63SQ,20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K30ETC144-1N Datasheet Download
EPF10K30ETC144-1N Overview
The chip model EPF10K30ETC144-1N is an integrated circuit (IC) chip that has been developed for use in a variety of electronic devices. It is a high-performance, low-power, and low-cost solution for applications in a wide range of industries. The chip provides a wide range of features and capabilities that make it a great choice for applications that require high performance and low power consumption.
The EPF10K30ETC144-1N chip is designed to provide a high-speed, low-power, and low-cost solution for a variety of applications. It is designed to be used in a wide range of applications, including automotive, industrial, medical, and consumer electronics. The chip is designed to be used in a variety of applications, including automotive, industrial, medical, and consumer electronics. It is designed to provide a high-speed, low-power, and low-cost solution for a variety of applications.
The EPF10K30ETC144-1N chip is designed to be used in a wide range of industries. It is designed to be used in a variety of applications, including automotive, industrial, medical, and consumer electronics. The chip is designed to provide a high-speed, low-power, and low-cost solution for a variety of applications. It is designed to provide a high-speed, low-power, and low-cost solution for a variety of applications.
The chip model EPF10K30ETC144-1N is an excellent choice for applications that require high performance and low power consumption. The chip supports a wide range of features and capabilities, making it an ideal choice for a variety of applications. As the industry trends continue to evolve, the chip model EPF10K30ETC144-1N can be used to support the development and popularization of future intelligent robots. The chip is designed to be used in a variety of applications, including automotive, industrial, medical, and consumer electronics.
The EPF10K30ETC144-1N chip is designed to provide a high-speed, low-power, and low-cost solution for a variety of applications. It is important to note that the application environment may require the support of new technologies for the chip model to be effective. Technical talents are needed to use the chip model effectively and to ensure that the application environment is properly supported.
In conclusion, the chip model EPF10K30ETC144-1N is a great choice for applications that require high performance and low power consumption. The chip is designed to provide a high-speed, low-power, and low-cost solution for a variety of applications. It is also designed to be used in a variety of applications, including automotive, industrial, medical, and consumer electronics. The chip model can be used to support the development and popularization of future intelligent robots and may require the support of new technologies. Technical talents are needed to use the chip model effectively and to ensure that the application environment is properly supported.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||