Intel Corporation
EPF10K30EFI256-3
EPF10K30EFI256-3 ECAD Model
EPF10K30EFI256-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 12.5 ns | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 1728 | |
| Number of I/O Lines | 176 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 176 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K30EFI256-3 Datasheet Download
EPF10K30EFI256-3 Overview
The chip model EPF10K30EFI256-3 is an ideal choice for high-performance digital signal processing, embedded processing, and image processing. With its excellent performance, it is capable of handling large amounts of data with ease and speed. The EPF10K30EFI256-3 is designed to be used with the HDL language, which is a versatile and powerful language for programming and controlling digital devices.
The EPF10K30EFI256-3 is a powerful chip model that has a wide range of applications. It can be used in industries such as automotive, aerospace, medical, and communications. It is also suitable for use in the development of intelligent robots, as it is capable of handling complex tasks with ease. The chip model is also designed to be used with the HDL language, which is a versatile and powerful language for programming and controlling digital devices.
The EPF10K30EFI256-3 is expected to be in high demand in the near future, as the demand for high-performance digital signal processing, embedded processing, and image processing increases. As the technology advances, the chip model is expected to be used in more applications and industries. This chip model is also expected to be used in the development and popularization of future intelligent robots, as it is capable of handling complex tasks with ease.
In order to use the chip model EPF10K30EFI256-3 effectively, certain technical talents are required. This includes knowledge of the HDL language, as well as experience in programming and controlling digital devices. Additionally, knowledge of the hardware and software of the chip model is also necessary. Those who are familiar with these aspects of the chip model will be able to use it to its fullest potential.
Overall, the chip model EPF10K30EFI256-3 is a powerful and versatile chip model that is suitable for a wide range of applications. It is expected to be in high demand in the near future and can be used in the development and popularization of future intelligent robots. In order to use the chip model effectively, certain technical talents are required, such as knowledge of the HDL language and experience in programming and controlling digital devices.
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5,307 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $29.7600 | $29.7600 |
| 10+ | $29.4400 | $294.4000 |
| 100+ | $27.8400 | $2,784.0000 |
| 1000+ | $26.2400 | $13,120.0000 |
| 10000+ | $24.0000 | $24,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||