
Intel Corporation
EPF10K30EFI256-2
EPF10K30EFI256-2 ECAD Model
EPF10K30EFI256-2 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 400 ps | |
Number of Inputs | 176 | |
Number of Outputs | 176 | |
Number of Logic Cells | 1728 | |
Number of I/O Lines | 176 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 176 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA256,16X16,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EPF10K30EFI256-2 Datasheet Download
EPF10K30EFI256-2 Overview
The chip model EPF10K30EFI256-2 is a powerful and versatile integrated circuit that has been designed to meet the needs of a variety of industries. It is a field programmable gate array (FPGA) that offers a wide range of features, including high-speed data processing, low power consumption, and a large number of inputs and outputs. This makes it suitable for a wide range of applications, from industrial automation to medical imaging and beyond.
The EPF10K30EFI256-2 chip model has many advantages over other models, such as its high-speed data processing capabilities, low power consumption, and a large number of inputs and outputs. This makes it ideal for applications where speed and efficiency are paramount. Additionally, the chip model is highly customizable, allowing users to tailor it to their specific needs. This makes it an ideal choice for a variety of industries, such as automotive, medical, and industrial automation.
The demand for the EPF10K30EFI256-2 chip model is expected to continue to grow in the future as more industries are recognizing the advantages of using this chip model. It is especially well suited for applications that require high-speed data processing and low power consumption, such as autonomous vehicles and medical imaging. Additionally, as the world moves towards a more connected and automated future, the chip model is likely to become increasingly important in a variety of networked and intelligent scenarios.
The EPF10K30EFI256-2 chip model is designed to meet the specific requirements of each application. It is capable of processing large amounts of data quickly and efficiently, and is able to perform a variety of tasks, including image processing, signal processing, and control. Additionally, it is highly customizable, allowing users to tailor it to their specific needs.
In order to ensure that the chip model is used correctly, it is important to understand the product description and design requirements. This includes understanding the power requirements, the number of inputs and outputs, and the specific tasks that the chip model is capable of performing. Additionally, it is important to understand the precautions that need to be taken when using the chip model, such as ensuring that the chip model is not exposed to extreme temperatures or other environmental conditions.
Finally, it is important to understand how the chip model is being used in real-world applications. Case studies can be a great way to learn more about how the chip model is being used and how it is performing. This can help to inform decisions about whether the chip model is suitable for a particular application and can provide valuable insight into how the chip model can be used in the future.
In conclusion, the EPF10K30EFI256-2 chip model is a powerful and versatile integrated circuit that is suitable for a variety of applications. It offers a wide range of features, including high-speed data processing, low power consumption, and a large number of inputs and outputs. The demand for this chip model is expected to continue to grow in the future, and it is likely to be used in a variety of networked and intelligent scenarios. It is important to understand the product description and design requirements of the chip model, as well as the precautions that need to be taken when using it. Additionally, case studies can provide insight into how the chip model is being used in the real world and how it can be used in the future.
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