Intel Corporation
EPF10K30EFC484-3
EPF10K30EFC484-3 ECAD Model
EPF10K30EFC484-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 600 ps | |
| Number of Inputs | 220 | |
| Number of Outputs | 220 | |
| Number of Logic Cells | 1728 | |
| Number of I/O Lines | 220 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 220 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K30EFC484-3 Datasheet Download
EPF10K30EFC484-3 Overview
The chip model EPF10K30EFC484-3 is a powerful and versatile model that can be used for a variety of applications. It is designed to provide high-performance digital signal processing, embedded processing, image processing, and other related tasks. It is designed to be used with the HDL language, which is a hardware description language used to program digital logic circuits.
The original design intention of the chip model EPF10K30EFC484-3 was to provide a powerful and reliable platform for digital signal processing, embedded processing, and image processing. It is capable of handling complex tasks and can be upgraded in the future to provide additional features and performance. It can also be used for advanced communication systems, as it has the capability to process and transmit data quickly and accurately.
The chip model EPF10K30EFC484-3 can also be used for the development and popularization of future intelligent robots. It is capable of providing the necessary computational power and accuracy needed to control and monitor the robot's movements. To use the model effectively, one must have experience in programming with the HDL language and have a good understanding of the hardware and software components of the model.
In conclusion, the EPF10K30EFC484-3 chip model is a powerful and versatile model that can be used for a variety of applications. It is designed to provide high-performance digital signal processing, embedded processing, image processing, and other related tasks. It is capable of handling complex tasks and can be upgraded in the future to provide additional features and performance. It can also be used for advanced communication systems, as well as for the development and popularization of future intelligent robots. To use the model effectively, one must have experience in programming with the HDL language and have a good understanding of the hardware and software components of the model.
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4,858 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $91.5120 | $91.5120 |
| 10+ | $90.5280 | $905.2800 |
| 100+ | $85.6080 | $8,560.8000 |
| 1000+ | $80.6880 | $40,344.0000 |
| 10000+ | $73.8000 | $73,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||