Intel Corporation
EPF10K30EFC484-2X
EPF10K30EFC484-2X ECAD Model
EPF10K30EFC484-2X Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 400 ps | |
| Number of Inputs | 220 | |
| Number of Outputs | 220 | |
| Number of Logic Cells | 1728 | |
| Number of I/O Lines | 220 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 220 I/O | |
| Output Function | MIXED | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K30EFC484-2X Datasheet Download
EPF10K30EFC484-2X Overview
The chip model EPF10K30EFC484-2X is a high-performance integrated circuit designed for digital signal processing, embedded processing, image processing and other applications. It is an advanced FPGA device that requires the use of HDL language to develop the hardware logic for the desired application.
The EPF10K30EFC484-2X is a powerful chip model that offers a wide range of features and capabilities. It has a high-performance architecture that allows for the integration of multiple components into a single chip. It also has a high-speed data processing capability, allowing it to process large amounts of data quickly and efficiently. Additionally, it supports a wide range of communication protocols, making it suitable for a variety of applications.
The original design intention of the EPF10K30EFC484-2X was to create a chip model that could be used in high-performance applications and that could be upgraded in the future. This chip model is capable of being used in advanced communication systems and can be used for a wide range of applications. It is also capable of being upgraded in the future to meet the demands of new technologies.
Regarding the industry trends of the EPF10K30EFC484-2X and the future development of related industries, the chip model is expected to remain a popular choice for a variety of applications. As new technologies emerge, the EPF10K30EFC484-2X may need to be upgraded to support these new technologies. However, the exact technologies that will be required will depend on the specific application environment.
Overall, the EPF10K30EFC484-2X is a powerful chip model that is designed for high-performance applications. It has a high-performance architecture and is capable of being used in advanced communication systems. Additionally, it is capable of being upgraded in the future to meet the demands of new technologies. The EPF10K30EFC484-2X is expected to remain a popular choice for a variety of applications and is likely to continue to be used in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||