
Intel Corporation
EPF10K30EFC484-1
EPF10K30EFC484-1 ECAD Model
EPF10K30EFC484-1 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 400 ps | |
Number of Inputs | 220 | |
Number of Outputs | 220 | |
Number of Logic Cells | 1728 | |
Number of I/O Lines | 220 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 220 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA484,22X22,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
EPF10K30EFC484-1 Datasheet Download
EPF10K30EFC484-1 Overview
The chip model EPF10K30EFC484-1 is a high-performance, low-power, field-programmable gate array (FPGA) device. It is a member of the EPF10K family of FPGA devices from Altera Corporation, and is designed to meet the needs of high-speed, low-power applications. This chip model is suitable for a wide range of applications, such as high-speed networking, multimedia, and embedded systems.
The EPF10K30EFC484-1 chip model has several advantages that make it an attractive choice for many applications. First, it is a low-power device, meaning it consumes less energy than most other FPGA devices. Its power efficiency also makes it suitable for portable applications. Second, it has a very high level of integration, meaning it can be used to implement complex systems on a single chip. Finally, it has a large number of configurable logic blocks, allowing for the implementation of powerful digital signal processing algorithms.
The EPF10K30EFC484-1 chip model is expected to be in high demand in the future as more applications require the use of FPGA devices. Its low power consumption and high level of integration make it an ideal choice for applications such as medical imaging, automotive systems, and industrial automation. Furthermore, its configurable logic blocks make it suitable for advanced communication systems such as 5G networks.
The EPF10K30EFC484-1 chip model was designed with the intention of providing a high-performance, low-power FPGA device. It is expected that the chip model will continue to be upgraded in the future to provide more features and capabilities. In addition, the chip model is capable of being used in advanced communication systems, as long as the necessary technologies are available. As such, the EPF10K30EFC484-1 chip model is an ideal choice for a wide range of applications, and is expected to remain in high demand in the future.
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2,896 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $103.1273 | $103.1273 |
10+ | $102.0184 | $1,020.1843 |
100+ | $96.4740 | $9,647.3952 |
1000+ | $90.9295 | $45,464.7360 |
10000+ | $83.1672 | $83,167.2000 |
The price is for reference only, please refer to the actual quotation! |