EPF10K30EFC484-1
EPF10K30EFC484-1
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rohs

Intel Corporation

EPF10K30EFC484-1


EPF10K30EFC484-1
F18-EPF10K30EFC484-1
Active
LOADABLE PLD, 400 ps, CMOS, BGA, BGA484,22X22,40
BGA, BGA484,22X22,40

EPF10K30EFC484-1 ECAD Model


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EPF10K30EFC484-1 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 400 ps
Number of Inputs 220
Number of Outputs 220
Number of Logic Cells 1728
Number of I/O Lines 220
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 220 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA484,22X22,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

EPF10K30EFC484-1 Datasheet Download


EPF10K30EFC484-1 Overview



The chip model EPF10K30EFC484-1 is a high-performance, low-power, field-programmable gate array (FPGA) device. It is a member of the EPF10K family of FPGA devices from Altera Corporation, and is designed to meet the needs of high-speed, low-power applications. This chip model is suitable for a wide range of applications, such as high-speed networking, multimedia, and embedded systems.


The EPF10K30EFC484-1 chip model has several advantages that make it an attractive choice for many applications. First, it is a low-power device, meaning it consumes less energy than most other FPGA devices. Its power efficiency also makes it suitable for portable applications. Second, it has a very high level of integration, meaning it can be used to implement complex systems on a single chip. Finally, it has a large number of configurable logic blocks, allowing for the implementation of powerful digital signal processing algorithms.


The EPF10K30EFC484-1 chip model is expected to be in high demand in the future as more applications require the use of FPGA devices. Its low power consumption and high level of integration make it an ideal choice for applications such as medical imaging, automotive systems, and industrial automation. Furthermore, its configurable logic blocks make it suitable for advanced communication systems such as 5G networks.


The EPF10K30EFC484-1 chip model was designed with the intention of providing a high-performance, low-power FPGA device. It is expected that the chip model will continue to be upgraded in the future to provide more features and capabilities. In addition, the chip model is capable of being used in advanced communication systems, as long as the necessary technologies are available. As such, the EPF10K30EFC484-1 chip model is an ideal choice for a wide range of applications, and is expected to remain in high demand in the future.



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Unit Price: $110.8896
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Pricing (USD)

QTY Unit Price Ext Price
1+ $103.1273 $103.1273
10+ $102.0184 $1,020.1843
100+ $96.4740 $9,647.3952
1000+ $90.9295 $45,464.7360
10000+ $83.1672 $83,167.2000
The price is for reference only, please refer to the actual quotation!

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