
Intel Corporation
EPF10K30EFC256-2N
EPF10K30EFC256-2N ECAD Model
EPF10K30EFC256-2N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 400 ps | |
Number of Inputs | 176 | |
Number of Outputs | 176 | |
Number of Logic Cells | 1728 | |
Number of I/O Lines | 176 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 176 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA256,16X16,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EPF10K30EFC256-2N Datasheet Download
EPF10K30EFC256-2N Overview
The EPF10K30EFC256-2N is an advanced chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that allows for the efficient design of complex digital systems. With its powerful capabilities, the EPF10K30EFC256-2N is suitable for a wide range of applications, from consumer electronics to industrial automation.
The EPF10K30EFC256-2N has several advantages over other chip models. It offers high-speed performance and low power consumption, making it suitable for use in a wide range of applications. Additionally, its modular design allows for easy integration into existing systems. This makes it ideal for use in a variety of industries, from automotive to aerospace.
The demand for the EPF10K30EFC256-2N is expected to grow in the future. As the demand for more powerful and efficient digital signal processing, embedded processing, and image processing increases, this chip model will become increasingly important. Additionally, as the need for intelligent systems increases, the EPF10K30EFC256-2N will be well-suited for use in networks and in intelligent scenarios.
The EPF10K30EFC256-2N is capable of being used in the era of fully intelligent systems. It is capable of handling large amounts of data and performing complex operations quickly and efficiently. This makes it ideal for use in intelligent systems, such as self-driving cars, automated factories, and smart home systems. Additionally, its modular design allows for easy integration into existing systems.
The EPF10K30EFC256-2N is a powerful and versatile chip model that is suitable for a wide range of applications. It is designed for high-performance digital signal processing, embedded processing, and image processing, and its modular design allows for easy integration into existing systems. As the demand for more powerful and efficient digital signal processing, embedded processing, and image processing increases, the demand for the EPF10K30EFC256-2N is expected to grow. Additionally, its capabilities make it ideal for use in networks and in intelligent scenarios, and it is capable of being used in the era of fully intelligent systems.
You May Also Be Interested In
5,982 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $61.6451 | $61.6451 |
10+ | $60.9822 | $609.8220 |
100+ | $57.6680 | $5,766.7950 |
1000+ | $54.3537 | $27,176.8500 |
10000+ | $49.7138 | $49,713.7500 |
The price is for reference only, please refer to the actual quotation! |