EPF10K30EFC256-2N
EPF10K30EFC256-2N
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rohs

Intel Corporation

EPF10K30EFC256-2N


EPF10K30EFC256-2N
F18-EPF10K30EFC256-2N
Active
LOADABLE PLD, 400 ps, CMOS, BGA, BGA256,16X16,40
BGA, BGA256,16X16,40

EPF10K30EFC256-2N ECAD Model


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EPF10K30EFC256-2N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 400 ps
Number of Inputs 176
Number of Outputs 176
Number of Logic Cells 1728
Number of I/O Lines 176
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 176 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA256,16X16,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EPF10K30EFC256-2N Datasheet Download


EPF10K30EFC256-2N Overview



The EPF10K30EFC256-2N is an advanced chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that allows for the efficient design of complex digital systems. With its powerful capabilities, the EPF10K30EFC256-2N is suitable for a wide range of applications, from consumer electronics to industrial automation.


The EPF10K30EFC256-2N has several advantages over other chip models. It offers high-speed performance and low power consumption, making it suitable for use in a wide range of applications. Additionally, its modular design allows for easy integration into existing systems. This makes it ideal for use in a variety of industries, from automotive to aerospace.


The demand for the EPF10K30EFC256-2N is expected to grow in the future. As the demand for more powerful and efficient digital signal processing, embedded processing, and image processing increases, this chip model will become increasingly important. Additionally, as the need for intelligent systems increases, the EPF10K30EFC256-2N will be well-suited for use in networks and in intelligent scenarios.


The EPF10K30EFC256-2N is capable of being used in the era of fully intelligent systems. It is capable of handling large amounts of data and performing complex operations quickly and efficiently. This makes it ideal for use in intelligent systems, such as self-driving cars, automated factories, and smart home systems. Additionally, its modular design allows for easy integration into existing systems.


The EPF10K30EFC256-2N is a powerful and versatile chip model that is suitable for a wide range of applications. It is designed for high-performance digital signal processing, embedded processing, and image processing, and its modular design allows for easy integration into existing systems. As the demand for more powerful and efficient digital signal processing, embedded processing, and image processing increases, the demand for the EPF10K30EFC256-2N is expected to grow. Additionally, its capabilities make it ideal for use in networks and in intelligent scenarios, and it is capable of being used in the era of fully intelligent systems.



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Unit Price: $66.285
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Pricing (USD)

QTY Unit Price Ext Price
1+ $61.6451 $61.6451
10+ $60.9822 $609.8220
100+ $57.6680 $5,766.7950
1000+ $54.3537 $27,176.8500
10000+ $49.7138 $49,713.7500
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