Intel Corporation
EPF10K30BC356-3
EPF10K30BC356-3 ECAD Model
EPF10K30BC356-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 600 ps | |
| Number of Inputs | 246 | |
| Number of Outputs | 246 | |
| Number of Logic Cells | 1728 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 246 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 246 I/O | |
| Additional Feature | 1728 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | |
| Clock Frequency-Max | 66.67 MHz | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, BGA356,26X26,50 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K30BC356-3 Datasheet Download
EPF10K30BC356-3 Overview
The chip model EPF10K30BC356-3 is a powerful semiconductor device with a wide range of applications. It is designed for high-performance digital signal processing, embedded processing, and image processing, and requires the use of HDL language. This chip model has many advantages that make it an attractive choice for many industries.
The EPF10K30BC356-3 is a high-performance, low-power solution for digital signal processing applications. It is capable of handling complex algorithms and data sets, and is highly reliable. Additionally, the chip model is highly scalable, allowing for easy expansion and customization. It also offers low latency and high throughput, making it ideal for use in high-performance applications.
The EPF10K30BC356-3 is expected to be in high demand in the future, as it can be used in a variety of industries. It is particularly useful in the automotive, medical, and aerospace industries, as it can be used for advanced imaging, navigation, and autonomous control. Additionally, it can be used in telecommunications and consumer electronics.
The EPF10K30BC356-3 can be used in networks and intelligent scenarios. It can be used to improve the performance of networks, such as in wireless and cellular networks. Additionally, it can be used in intelligent systems, such as in autonomous vehicles, robotics, and artificial intelligence. It can also be used in the era of fully intelligent systems, where it can be used to improve decision making and data processing.
Overall, the EPF10K30BC356-3 is a powerful and reliable chip model that is well suited for a wide range of applications. It is highly scalable and can be used in a variety of industries, from automotive to telecommunications. Additionally, it can be used in networks and intelligent scenarios, and can be used in the era of fully intelligent systems. This chip model is sure to be in high demand in the future, as more industries and applications take advantage of its powerful capabilities.
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4,727 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $54.4050 | $54.4050 |
| 10+ | $53.8200 | $538.2000 |
| 100+ | $50.8950 | $5,089.5000 |
| 1000+ | $47.9700 | $23,985.0000 |
| 10000+ | $43.8750 | $43,875.0000 |
| The price is for reference only, please refer to the actual quotation! | ||