EPF10K30AFC256-2
EPF10K30AFC256-2
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rohs

Intel Corporation

EPF10K30AFC256-2


EPF10K30AFC256-2
F18-EPF10K30AFC256-2
Active
LOADABLE PLD, 700 ps, CMOS, BGA, BGA256,16X16,40
BGA, BGA256,16X16,40

EPF10K30AFC256-2 ECAD Model


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EPF10K30AFC256-2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Propagation Delay 700 ps
Number of Inputs 246
Number of Outputs 246
Number of Logic Cells 1728
Number of Dedicated Inputs 4
Number of I/O Lines 191
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 191 I/O
Additional Feature 1728 LOGIC ELEMENTS; 216 LABS
Clock Frequency-Max 80 MHz
Output Function REGISTERED
Power Supplies 2.5/3.3,3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA256,16X16,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EPF10K30AFC256-2 Datasheet Download


EPF10K30AFC256-2 Overview



The chip model EPF10K30AFC256-2 is a high-performance integrated circuit that is widely used in a variety of embedded system applications. It is an innovative product that offers a combination of features and performance that is not available with other devices. The model is designed to meet the needs of a wide range of users, from those who require a high-performance solution to those who are looking for a more cost-effective solution.


The EPF10K30AFC256-2 chip model is designed to offer a wide range of features and performance, including a high-speed interface, low power consumption, and a high-performance processor. This model also features an integrated memory controller, an advanced bus architecture, and a wide range of peripherals. With these features, the EPF10K30AFC256-2 chip model is suitable for a variety of applications, including embedded systems, automotive systems, and industrial automation.


The industry trends of the EPF10K30AFC256-2 chip model are expected to continue to be strong. This is due to the increasing demand for high-performance embedded systems and the need for cost-effective solutions. The EPF10K30AFC256-2 chip model is also expected to be used in a variety of advanced communication systems, as it is capable of providing a high-speed interface and a low power consumption.


The original design intention of the EPF10K30AFC256-2 chip model was to provide a high-performance solution for a wide range of applications. As such, the model is designed to be highly reliable and to offer a wide range of features and performance. It is also designed to be upgradable, allowing users to upgrade their systems as needed. This allows users to take advantage of new technologies and to keep their systems up to date with the latest developments.


The EPF10K30AFC256-2 chip model is expected to be in high demand in the future. This is due to its wide range of features and performance, as well as its ability to be upgraded. The model is also expected to be used in a variety of advanced communication systems, as it is capable of providing a high-speed interface and a low power consumption. As such, the EPF10K30AFC256-2 chip model is expected to remain a popular choice for a variety of embedded systems, automotive systems, and industrial automation applications.



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Unit Price: $106.9085
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Pricing (USD)

QTY Unit Price Ext Price
1+ $99.4249 $99.4249
10+ $98.3558 $983.5582
100+ $93.0104 $9,301.0395
1000+ $87.6650 $43,832.4850
10000+ $80.1814 $80,181.3750
The price is for reference only, please refer to the actual quotation!

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