EPF10K30AFC256-1
EPF10K30AFC256-1
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rohs

Intel Corporation

EPF10K30AFC256-1


EPF10K30AFC256-1
F18-EPF10K30AFC256-1
Active
LOADABLE PLD, 600 ps, CMOS, BGA, BGA256,16X16,40
BGA, BGA256,16X16,40

EPF10K30AFC256-1 ECAD Model


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EPF10K30AFC256-1 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Propagation Delay 600 ps
Number of Inputs 246
Number of Outputs 246
Number of Logic Cells 1728
Number of Dedicated Inputs 4
Number of I/O Lines 191
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 191 I/O
Additional Feature 1728 LOGIC ELEMENTS; 216 LABS
Clock Frequency-Max 80 MHz
Output Function REGISTERED
Power Supplies 2.5/3.3,3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA256,16X16,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EPF10K30AFC256-1 Datasheet Download


EPF10K30AFC256-1 Overview



The chip model EPF10K30AFC256-1 is an integrated circuit designed for advanced applications in the electronics industry. It is a highly integrated device that integrates multiple functions into a single chip, allowing for greater efficiency and flexibility. The chip model is designed to be used in a wide range of applications, from consumer electronics to industrial electronics.


The industry trends of the chip model EPF10K30AFC256-1 are constantly evolving, as new technologies and innovations are continually being developed and released. With the introduction of new technologies and advancements in the industry, the chip model is becoming increasingly versatile and powerful. This allows the chip model to be used in a variety of applications, from consumer electronics to industrial electronics.


The original design intention of the chip model EPF10K30AFC256-1 was to provide a high level of integration and performance in a single chip. The chip model is capable of providing a wide range of features, such as high-speed data transfer, low power consumption, and low latency. Additionally, the chip model is designed to be used in a variety of applications, ranging from consumer electronics to industrial electronics.


The future development of the chip model EPF10K30AFC256-1 is dependent on the application environment and the specific technologies needed. As new technologies and advancements in the industry continue to be released, the chip model will continue to evolve and become more powerful and versatile. Additionally, the chip model may be upgraded with new features and capabilities, allowing for more advanced applications.


The chip model EPF10K30AFC256-1 can be applied to the development and popularization of future intelligent robots. The chip model is designed to be used in a variety of applications, from consumer electronics to industrial electronics. As such, the chip model is capable of providing a wide range of features and capabilities, such as high-speed data transfer, low power consumption, and low latency. Additionally, the chip model is designed to be used in a variety of applications, ranging from consumer electronics to industrial electronics.


In order to effectively use the chip model EPF10K30AFC256-1, a variety of technical talents are needed. These include software engineers, electrical engineers, and robotics specialists. Software engineers are responsible for developing the software that will be used to control the chip model, while electrical engineers are responsible for designing the circuits that will be used to interface with the chip model. Robotics specialists are responsible for developing the algorithms and programs that will be used to control the chip model. Additionally, these specialists are responsible for ensuring that the chip model is compatible with the application environment.


The chip model EPF10K30AFC256-1 is a powerful and versatile integrated circuit designed for advanced applications in the electronics industry. With the introduction of new technologies and advancements in the industry, the chip model is becoming increasingly powerful and versatile. This allows the chip model to be used in a variety of applications, from consumer electronics to industrial electronics. Additionally, the chip model can be used to develop and popularize future intelligent robots, with the help of software engineers, electrical engineers, and robotics specialists.



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Unit Price: $106.9085
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $99.4249 $99.4249
10+ $98.3558 $983.5582
100+ $93.0104 $9,301.0395
1000+ $87.6650 $43,832.4850
10000+ $80.1814 $80,181.3750
The price is for reference only, please refer to the actual quotation!

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