Intel Corporation
EPF10K30ABC356-3
EPF10K30ABC356-3 ECAD Model
EPF10K30ABC356-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 900 ps | |
| Number of Inputs | 246 | |
| Number of Outputs | 246 | |
| Number of Logic Cells | 1728 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 246 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 246 I/O | |
| Additional Feature | 1728 LOGIC ELEMENTS; 216 LABS | |
| Clock Frequency-Max | 80 MHz | |
| Output Function | REGISTERED | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, BGA356,26X26,50 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K30ABC356-3 Datasheet Download
EPF10K30ABC356-3 Overview
The chip model EPF10K30ABC356-3 is a powerful digital signal processor (DSP) designed for high-performance applications such as embedded processing, image processing, and digital signal processing. It is designed to be used with the hardware description language (HDL) and is capable of executing complex tasks quickly and efficiently.
The EPF10K30ABC356-3 chip model offers a number of advantages over other DSPs. It has a wide range of input and output options, allowing it to be used in a variety of applications. It also has a high degree of flexibility, allowing it to be tailored to meet specific requirements. Additionally, it has a low power consumption, making it well suited for applications where power efficiency is essential.
The EPF10K30ABC356-3 chip model is expected to be in high demand in the coming years. This is due to the increasing need for high-performance DSPs in various industries, as well as the growing demand for efficient and reliable solutions. Furthermore, the chip model is highly scalable, allowing it to be adapted to new applications as they arise.
The original design intention of the EPF10K30ABC356-3 chip model was to provide a powerful and reliable solution for high-performance applications. It has the capability to be upgraded with newer technologies, meaning that it can remain competitive in the future. Furthermore, its scalability makes it suitable for use in advanced communication systems, such as 5G networks.
In conclusion, the EPF10K30ABC356-3 chip model is an ideal solution for high-performance applications. It is highly efficient, reliable, and adaptable, making it well suited for a variety of uses. Furthermore, it is expected to be in high demand in the future due to its scalability and upgradability. Finally, it is suitable for use in advanced communication systems, making it an ideal choice for a wide range of applications.
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5,921 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $116.9434 | $116.9434 |
| 10+ | $115.6860 | $1,156.8595 |
| 100+ | $109.3987 | $10,939.8672 |
| 1000+ | $103.1114 | $51,555.6960 |
| 10000+ | $94.3092 | $94,309.2000 |
| The price is for reference only, please refer to the actual quotation! | ||