Intel Corporation
EPF10K250EFI672-3
EPF10K250EFI672-3 ECAD Model
EPF10K250EFI672-3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 470 | |
| Number of Outputs | 470 | |
| Number of Logic Cells | 12160 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 470 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 470 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K250EFI672-3 Overview
The chip model EPF10K250EFI672-3 was originally designed to meet the advanced communication needs of modern systems. It has a wide range of features that make it a great choice for network applications, including high-speed processing, low-power consumption, and a high level of integration. This chip model is capable of supporting the advanced data-handling and communication needs of today's networks, and its design intention is to provide customers with a reliable and efficient communication solution.
The EPF10K250EFI672-3 chip model can also be used in advanced intelligent scenarios, such as machine learning and artificial intelligence. Its high-speed processing capabilities and low-power consumption make it an ideal choice for these applications. Moreover, its integrated design allows for the development of more sophisticated systems, such as those used in self-driving cars, autonomous robots, and other intelligent systems.
The EPF10K250EFI672-3 chip model is also suitable for the development and popularization of future intelligent robots. Its advanced features, such as its high-speed processing capabilities, make it a great choice for robotics applications. In addition, its low-power consumption and integrated design make it an ideal choice for the development of advanced robotic systems.
To effectively use the EPF10K250EFI672-3 chip model, technical talents with a background in computer engineering, electrical engineering, and robotics engineering are needed. These professionals should have a deep understanding of the chip model's features, its capabilities, and its limitations. They should also have the necessary skills to program the chip model and develop advanced robotic systems.
In conclusion, the EPF10K250EFI672-3 chip model is an excellent choice for advanced communication systems, intelligent scenarios, and robotic applications. Its design intention is to provide customers with a reliable and efficient communication solution, and its advanced features make it a great choice for the development and popularization of future intelligent robots. In order to effectively use the chip model, technical talents with a background in computer engineering, electrical engineering, and robotics engineering are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||