Intel Corporation
EPF10K250EFC672-3
EPF10K250EFC672-3 ECAD Model
EPF10K250EFC672-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 470 | |
| Number of Outputs | 470 | |
| Number of Logic Cells | 12160 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 470 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 470 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K250EFC672-3 Datasheet Download
EPF10K250EFC672-3 Overview
The chip model EPF10K250EFC672-3 is a highly advanced integrated circuit designed for use in a variety of electronic applications. It is manufactured by Altera, a leading provider of programmable logic devices and related solutions. This model is designed to provide high-speed performance and low power consumption, making it an ideal choice for a wide range of applications.
The EPF10K250EFC672-3 is an FPGA-based device that offers a wide range of features and capabilities. It is capable of providing up to 250 MHz of processing power and can be used in a variety of communication systems. This model also comes with a variety of features such as high-speed memory, high-speed I/O, and advanced features such as error correction, bus arbitration, and data compression.
In terms of industry trends, the EPF10K250EFC672-3 is a highly sought-after device due to its advanced features and capabilities. It is increasingly being used in a variety of applications, including automotive, industrial, and consumer electronics. With its high-speed processing power and low power consumption, it is also being used in the development of advanced communication systems.
As for the future development of this model, it is expected to be upgraded to support new technologies. For example, the model could be used in the development and popularization of future intelligent robots. This would require the use of advanced technologies such as artificial intelligence, machine learning, and natural language processing. Technical talents with expertise in these areas would be required to use the model effectively.
In conclusion, the chip model EPF10K250EFC672-3 is a highly advanced integrated circuit with a wide range of features and capabilities. It is increasingly being used in a variety of applications and is expected to be upgraded to support new technologies in the future. Technical talents with expertise in advanced technologies such as artificial intelligence, machine learning, and natural language processing would be required to use the model effectively.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||