EPF10K200SFI672-2X
EPF10K200SFI672-2X
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rohs

Intel Corporation

EPF10K200SFI672-2X


EPF10K200SFI672-2X
F18-EPF10K200SFI672-2X
Active
LOADABLE PLD, 600 ps, CMOS, BGA
BGA

EPF10K200SFI672-2X ECAD Model


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EPF10K200SFI672-2X Attributes


Type Description Select
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 600 ps
Number of I/O Lines 470
Programmable Logic Type LOADABLE PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 470 I/O
Output Function MIXED
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
JESD-609 Code e1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer INTEL CORP
Package Description BGA,
Reach Compliance Code unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EPF10K200SFI672-2X Datasheet Download


EPF10K200SFI672-2X Overview



The chip model EPF10K200SFI672-2X is a state-of-the-art integrated circuit designed to meet the requirements of advanced communication systems. It is a Field Programmable Gate Array (FPGA) that provides a high level of performance, flexibility, and scalability. This model is designed to provide significant advantages over its competitors, such as low power consumption, low cost, and high reliability.


The EPF10K200SFI672-2X is designed to meet the demands of the communication industry, such as those related to high-speed data transmission and processing. It is capable of handling large amounts of data, and its flexible architecture allows for a variety of configurations and customizations. This chip model is expected to be in high demand in the future due to its increased performance, reliability, and cost-effectiveness.


The original design intention of the EPF10K200SFI672-2X is to provide a robust, reliable, and cost-effective solution for communication systems. It is designed to be compatible with the latest communication protocols and standards, and it is capable of handling a variety of communication tasks. It is also designed to be highly upgradeable, allowing for future upgrades and modifications.


The product description of the EPF10K200SFI672-2X includes its features, such as its high-speed data transmission and processing capabilities, its low power consumption, its low cost, and its high reliability. It also includes its physical specifications, such as its size, weight, and power requirements. Additionally, the product description includes the design requirements and actual case studies of the chip model.


When working with the EPF10K200SFI672-2X, there are certain precautions that should be taken. For example, it is important to ensure that the chip is properly cooled and that the power supply is stable. Additionally, it is important to ensure that the chip is properly programmed and that all connections are secure.


In conclusion, the EPF10K200SFI672-2X is an advanced chip model designed to meet the demands of the communication industry. Its features and design requirements make it a reliable and cost-effective solution for communication systems, and its high level of performance, flexibility, and scalability make it an attractive option for the future. Its high demand in the future is expected to be driven by its increased performance, reliability, and cost-effectiveness.



4,850 In Stock


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