
Intel Corporation
EPF10K200SFI672-2X
EPF10K200SFI672-2X ECAD Model
EPF10K200SFI672-2X Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 600 ps | |
Number of I/O Lines | 470 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 470 I/O | |
Output Function | MIXED | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
EPF10K200SFI672-2X Datasheet Download
EPF10K200SFI672-2X Overview
The chip model EPF10K200SFI672-2X is a state-of-the-art integrated circuit designed to meet the requirements of advanced communication systems. It is a Field Programmable Gate Array (FPGA) that provides a high level of performance, flexibility, and scalability. This model is designed to provide significant advantages over its competitors, such as low power consumption, low cost, and high reliability.
The EPF10K200SFI672-2X is designed to meet the demands of the communication industry, such as those related to high-speed data transmission and processing. It is capable of handling large amounts of data, and its flexible architecture allows for a variety of configurations and customizations. This chip model is expected to be in high demand in the future due to its increased performance, reliability, and cost-effectiveness.
The original design intention of the EPF10K200SFI672-2X is to provide a robust, reliable, and cost-effective solution for communication systems. It is designed to be compatible with the latest communication protocols and standards, and it is capable of handling a variety of communication tasks. It is also designed to be highly upgradeable, allowing for future upgrades and modifications.
The product description of the EPF10K200SFI672-2X includes its features, such as its high-speed data transmission and processing capabilities, its low power consumption, its low cost, and its high reliability. It also includes its physical specifications, such as its size, weight, and power requirements. Additionally, the product description includes the design requirements and actual case studies of the chip model.
When working with the EPF10K200SFI672-2X, there are certain precautions that should be taken. For example, it is important to ensure that the chip is properly cooled and that the power supply is stable. Additionally, it is important to ensure that the chip is properly programmed and that all connections are secure.
In conclusion, the EPF10K200SFI672-2X is an advanced chip model designed to meet the demands of the communication industry. Its features and design requirements make it a reliable and cost-effective solution for communication systems, and its high level of performance, flexibility, and scalability make it an attractive option for the future. Its high demand in the future is expected to be driven by its increased performance, reliability, and cost-effectiveness.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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