Intel Corporation
EPF10K200SFC672-1
EPF10K200SFC672-1 ECAD Model
EPF10K200SFC672-1 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 300 ps | |
| Number of Inputs | 470 | |
| Number of Outputs | 470 | |
| Number of Logic Cells | 9984 | |
| Number of I/O Lines | 470 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 470 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K200SFC672-1 Datasheet Download
EPF10K200SFC672-1 Overview
The chip model EPF10K200SFC672-1 has become increasingly popular in the industry due to its advanced features and capabilities. As a result, it has become a popular choice for many industries, from telecommunications to automotive. It is designed to be compatible with a variety of applications and can be used in a wide range of scenarios.
In terms of industry trends, the EPF10K200SFC672-1 is expected to remain popular in the future, as more and more industries look to take advantage of its advanced features. It is also likely to become more widely used in the automotive sector, as the industry continues to move towards autonomous vehicles and connected systems.
In terms of future applications, the EPF10K200SFC672-1 is likely to be used in a variety of networks and intelligent scenarios. It is expected to be used in the internet of things (IoT) and other connected systems, as well as in autonomous vehicles. It is also likely to be used in the era of fully intelligent systems, as it is designed to be compatible with a variety of technologies.
In order to determine whether the EPF10K200SFC672-1 chip model is suitable for a specific application, it is important to assess the specific technologies needed for the application environment. This will ensure that the chip model is able to meet the requirements of the application. Additionally, it is important to consider the expected demand trends for the model in order to ensure that the chip remains popular in the future.
Overall, the EPF10K200SFC672-1 chip model is an increasingly popular choice for many industries due to its advanced features and capabilities. It is expected to remain popular in the future, as it is suitable for a variety of networks and intelligent scenarios. In order to determine whether the chip model is suitable for a specific application, it is important to assess the specific technologies needed for the application environment. Additionally, it is important to consider the expected demand trends for the model in order to ensure that the chip remains popular in the future.
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5,769 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $475.0142 | $475.0142 |
| 10+ | $469.9066 | $4,699.0656 |
| 100+ | $444.3682 | $44,436.8160 |
| 1000+ | $418.8298 | $209,414.8800 |
| 10000+ | $383.0760 | $383,076.0000 |
| The price is for reference only, please refer to the actual quotation! | ||