EPF10K200SFC484-2N
EPF10K200SFC484-2N
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rohs

Intel Corporation

EPF10K200SFC484-2N


EPF10K200SFC484-2N
F18-EPF10K200SFC484-2N
Active
LOADABLE PLD, 600 ps, CMOS, BGA, BGA484,22X22,40
BGA, BGA484,22X22,40

EPF10K200SFC484-2N ECAD Model


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EPF10K200SFC484-2N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 600 ps
Number of Inputs 369
Number of Outputs 369
Number of Logic Cells 9984
Number of I/O Lines 369
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 369 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA484,22X22,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

EPF10K200SFC484-2N Datasheet Download


EPF10K200SFC484-2N Overview



The EPF10K200SFC484-2N chip model is a powerful and versatile integrated circuit designed to meet the needs of modern electronics. It is a field programmable gate array (FPGA) with a wide range of applications in various industries. This model integrates a large number of logic elements and memory blocks, allowing for the development of complex systems. With its high performance and low power consumption, the EPF10K200SFC484-2N chip model is an ideal choice for the development of embedded systems.


The EPF10K200SFC484-2N chip model has several advantages over traditional integrated circuits. It offers a high level of flexibility, allowing users to configure the chip according to their specific needs. This means that the chip can be used in a wide range of applications, from consumer electronics to industrial automation. In addition, the chip is designed to be highly reliable, with a long life span and low power consumption.


The demand for the EPF10K200SFC484-2N chip model is expected to increase in the future. This is due to the growing need for embedded systems in various industries. These systems are used in a wide range of applications, including medical devices, automotive systems, and home automation. As such, the EPF10K200SFC484-2N chip model is an ideal solution for companies looking to develop these systems.


The original design intention of the EPF10K200SFC484-2N chip model was to provide a versatile and reliable integrated circuit for the development of embedded systems. The chip is capable of meeting the needs of a wide range of applications, and is designed to be highly reliable. In addition, the chip is designed to be upgradeable, allowing for future upgrades to be implemented. This makes the chip a great choice for companies looking to develop advanced embedded systems.


The EPF10K200SFC484-2N chip model can also be applied to the development and popularization of future intelligent robots. This is due to the chip’s powerful processing capabilities and its ability to be configured for specific applications. Furthermore, the chip is designed to be highly reliable, making it an ideal choice for the development of robots. In order to use the chip effectively, engineers and software developers with expertise in embedded systems and robotics will be needed.


In conclusion, the EPF10K200SFC484-2N chip model is an ideal choice for the development of embedded systems and robots. It offers a high level of flexibility and reliability, and is designed to be upgradeable. Furthermore, the chip is expected to be in high demand in the future due to its wide range of applications. In order to use the chip effectively, engineers and software developers with expertise in embedded systems and robotics will be needed.



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