Intel Corporation
EPF10K200SFC484-1N
EPF10K200SFC484-1N ECAD Model
EPF10K200SFC484-1N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 300 ps | |
| Number of Inputs | 369 | |
| Number of Outputs | 369 | |
| Number of Logic Cells | 9984 | |
| Number of I/O Lines | 369 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 369 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K200SFC484-1N Datasheet Download
EPF10K200SFC484-1N Overview
The chip model EPF10K200SFC484-1N is a powerful and versatile device that has been designed to meet the needs of modern communication systems. It is capable of providing high-speed data transmission and can be used for both wired and wireless networks. This model is also capable of supporting a wide variety of protocols, including Ethernet, Wi-Fi, Bluetooth, and others.
The original design intention of this model was to provide a reliable and secure solution for communication systems. It is equipped with advanced security features, such as encryption, authentication, and data integrity. Additionally, it is designed to support a wide variety of applications, including voice, video, and data.
The EPF10K200SFC484-1N has the potential to be upgraded in the future to support more advanced communication systems. It is capable of supporting the latest technologies, such as 5G, and can be used to build more intelligent networks. It is also capable of supporting the development of artificial intelligence (AI) and machine learning (ML) algorithms.
The EPF10K200SFC484-1N can be applied to a variety of intelligent scenarios. It can be used to create intelligent home systems, autonomous vehicles, and smart cities. It can also be used to develop and popularize intelligent robots. Additionally, it can be used to create intelligent networks for industrial automation and the Internet of Things (IoT).
To effectively use the EPF10K200SFC484-1N, a variety of technical skills are needed. These include knowledge of hardware and software design, communication protocols, and embedded systems. Additionally, a deep understanding of AI and ML algorithms is needed to create intelligent networks. Finally, knowledge of robotics and automation is needed to develop and popularize intelligent robots.
In conclusion, the EPF10K200SFC484-1N is a powerful and versatile chip model that has been designed to meet the needs of modern communication systems. It has the potential to be upgraded in the future to support more advanced communication systems and can be used to create intelligent networks. Additionally, it can be applied to a variety of intelligent scenarios and can be used to develop and popularize intelligent robots. To effectively use the EPF10K200SFC484-1N, a variety of technical skills are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||