Intel Corporation
EPF10K200EFC672-3
EPF10K200EFC672-3 ECAD Model
EPF10K200EFC672-3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 800 ps | |
| Number of Inputs | 470 | |
| Number of Outputs | 470 | |
| Number of Logic Cells | 9984 | |
| Number of I/O Lines | 470 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 470 I/O | |
| Additional Feature | 9984 LOGIC ELEMENTS | |
| Clock Frequency-Max | 140 MHz | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 | |
| Pin Count | 672 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K200EFC672-3 Overview
The chip model EPF10K200EFC672-3 is a state-of-the-art integrated circuit (IC) developed by Altera, a leading semiconductor company. It is a Field Programmable Gate Array (FPGA) device that is designed to be used in industrial and commercial applications. This chip model is highly versatile and can be used in a variety of applications, from industrial process control to data communications.
The EPF10K200EFC672-3 has several advantages over other FPGA devices. It is a low-cost solution that is capable of high performance, with a high-speed data transfer rate of up to 200 MHz. It also has a low power consumption and is highly reliable, making it ideal for applications that require long-term operation. Additionally, the chip model is highly flexible, allowing users to customize it to their specific needs.
In terms of future industry trends, the EPF10K200EFC672-3 is expected to remain a popular choice for industrial and commercial applications. As the demand for high-performance, low-cost solutions continues to grow, the chip model is likely to be in high demand in the coming years. Additionally, the chip model's flexibility and reliability make it an attractive option for applications that require long-term operation.
In terms of future applications, the EPF10K200EFC672-3 is expected to be used in a variety of networks and intelligent scenarios. It is likely to be used in industrial automation networks, as well as in intelligent transportation systems and connected home systems. Additionally, the chip model is expected to be used in the era of fully intelligent systems, where it will be used to process and analyze data in order to make decisions.
Overall, the EPF10K200EFC672-3 is a highly versatile and reliable chip model that is expected to remain in high demand in the future. Its low cost, high performance, and low power consumption make it an attractive option for a variety of applications, from industrial automation networks to intelligent transportation systems. Additionally, the chip model is expected to be used in the era of fully intelligent systems, where it will be used to process and analyze data in order to make decisions.
You May Also Be Interested In
5,477 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||