
Intel Corporation
EPF10K130EQC240-2
EPF10K130EQC240-2 ECAD Model
EPF10K130EQC240-2 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 500 ps | |
Number of Inputs | 186 | |
Number of Outputs | 186 | |
Number of Logic Cells | 6656 | |
Number of I/O Lines | 186 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 186 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Equivalence Code | QFP240,1.3SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 32 mm | |
Length | 32 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FQFP, QFP240,1.3SQ,20 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EPF10K130EQC240-2 Datasheet Download
EPF10K130EQC240-2 Overview
The chip model EPF10K130EQC240-2 is a powerful and reliable integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed with the HDL language, which is a hardware description language that allows users to design, simulate, and debug hardware designs. This chip model is perfect for applications that require high-speed and accurate processing of digital signals.
The original design intention of the chip model EPF10K130EQC240-2 was to provide a powerful and reliable integrated circuit for various applications that require digital signal processing. This chip model is also capable of being upgraded in the future, allowing users to add new features and capabilities as needed. Additionally, its design is flexible enough to be applied to advanced communication systems, making it an ideal choice for applications that require high-speed and reliable data transmission.
The chip model EPF10K130EQC240-2 can also be applied to the development and popularization of future intelligent robots. It provides the necessary features and capabilities to create robots that can accurately process digital signals and respond to various commands. To use the model effectively, users will need to have technical knowledge and expertise in the HDL language as well as experience in designing and programming embedded systems.
In conclusion, the chip model EPF10K130EQC240-2 is a powerful and reliable integrated circuit that can be used for various applications, such as digital signal processing, embedded processing, image processing, and advanced communication systems. It is also capable of being upgraded in the future and can be used to develop and popularize future intelligent robots. To use the model effectively, users will need to have technical knowledge and expertise in the HDL language as well as experience in designing and programming embedded systems.
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