Intel Corporation
EPF10K130EQC240-1X
EPF10K130EQC240-1X ECAD Model
EPF10K130EQC240-1X Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 300 ps | |
| Number of Inputs | 186 | |
| Number of Outputs | 186 | |
| Number of Logic Cells | 6656 | |
| Number of I/O Lines | 186 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 186 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | FQFP, QFP240,1.3SQ,20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Pin Count | 240 |
EPF10K130EQC240-1X Overview
The chip model EPF10K130EQC240-1X has become increasingly popular in the technology industry due to its many advantages. It is a field-programmable gate array (FPGA) chip, which is a type of integrated circuit that can be programmed to perform different digital operations. It is often used in the development of digital systems, as it can be programmed to perform different tasks. Compared to other types of integrated circuits, FPGAs offer greater flexibility and faster performance, making them an ideal choice for many applications.
The demand for the EPF10K130EQC240-1X model is expected to increase in the future, as more industries are turning to digital solutions for their needs. This chip model is particularly suited for applications in networks, as it can be programmed to provide a wide range of functions. It can be used to improve the speed and efficiency of network operations, as well as providing support for the development of intelligent systems.
The EPF10K130EQC240-1X chip model can also be used in the development of intelligent robots. It can be used to provide the necessary processing power to control the robot’s movements and actions. It can also be used to provide the necessary data processing and analysis capabilities to enable the robot to make decisions and respond to its environment. To use the chip model effectively for this purpose, technical talent is needed to program the chip and develop the necessary algorithms.
The EPF10K130EQC240-1X chip model is an ideal choice for many applications, as it offers a high level of flexibility and performance. It is expected to become increasingly popular in the future, as the demand for digital solutions continues to grow. Its potential applications in networks and intelligent robotics make it an ideal choice for many industries. With the right technical talent and knowledge, this chip model can be used to develop and popularize intelligent robots in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||