EPF10K130EFI672-3
EPF10K130EFI672-3
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rohs

Intel Corporation

EPF10K130EFI672-3


EPF10K130EFI672-3
F18-EPF10K130EFI672-3
Active
IC FPGA 413 I/O 672FBGA
672-FBGA (27x27)

EPF10K130EFI672-3 ECAD Model


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EPF10K130EFI672-3 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 2.5 V
Propagation Delay 16 ns
Number of Inputs 413
Number of Outputs 413
Number of Logic Cells 6656
Number of I/O Lines 413
Programmable Logic Type LOADABLE PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 413 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.3 V
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description BGA, BGA672,26X26,40
Pin Count 672
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EPF10K130EFI672-3 Overview



The chip model EPF10K130EFI672-3 is a field programmable gate array (FPGA) that has been developed by Altera Corporation. It is based on the company's Stratix 10 FPGA architecture and is a high-performance, low-power solution for a variety of applications. The EPF10K130EFI672-3 is a single-chip solution that can be used to implement a variety of functions, including high-speed signal processing, digital signal processing, and advanced communication systems.


The EPF10K130EFI672-3 has many advantages, including its high-speed signal processing capability, low-power consumption, and its ability to be easily integrated into existing systems. It is also a cost-effective solution for many applications due to its low cost and high performance. Furthermore, the EPF10K130EFI672-3 is designed to be highly scalable, allowing for future upgrades and modifications as needed.


The EPF10K130EFI672-3 is a versatile chip model that is suitable for a variety of applications, including high-speed signal processing, digital signal processing, and advanced communication systems. It is expected that the demand for the EPF10K130EFI672-3 will continue to grow in the future, as it is an ideal solution for many applications. Additionally, the EPF10K130EFI672-3 is designed to be highly scalable, allowing for future upgrades and modifications as needed.


The original design intention of the EPF10K130EFI672-3 was to create a single-chip solution that could be used to implement a variety of functions, including high-speed signal processing, digital signal processing, and advanced communication systems. This chip model was designed to be highly scalable, allowing for future upgrades and modifications as needed. As the demand for advanced communication systems increases, the EPF10K130EFI672-3 is expected to become more popular, as it is an ideal solution for many applications.


In conclusion, the EPF10K130EFI672-3 is a versatile chip model that is suitable for a variety of applications. It has many advantages, including its high-speed signal processing capability, low-power consumption, and its ability to be easily integrated into existing systems. The EPF10K130EFI672-3 is also designed to be highly scalable, allowing for future upgrades and modifications as needed. As the demand for advanced communication systems increases, the EPF10K130EFI672-3 is expected to become more popular, as it is an ideal solution for many applications.



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