Intel Corporation
EPF10K130EFI484-2
EPF10K130EFI484-2 ECAD Model
EPF10K130EFI484-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 500 ps | |
| Number of Inputs | 369 | |
| Number of Outputs | 369 | |
| Number of Logic Cells | 6656 | |
| Number of I/O Lines | 369 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 369 I/O | |
| Output Function | MIXED | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN/LEAD (SN63PB37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K130EFI484-2 Datasheet Download
EPF10K130EFI484-2 Overview
The chip model EPF10K130EFI484-2 is a highly integrated programmable logic device that can be used in a variety of industries and applications. It is designed to provide superior performance, reliability, and flexibility. This chip model has the advantage of being able to be used in a variety of industries, including automotive, communications, industrial, medical, and consumer electronics. It is also designed to be used in a variety of applications, such as digital signal processing, embedded systems, and system-on-chip (SoC) designs.
The expected demand for the chip model EPF10K130EFI484-2 is likely to continue to increase in the future, as the demand for more advanced and reliable products increases. This chip model is designed to be used in a wide range of applications, including automotive, communications, industrial, medical, and consumer electronics. As the demand for more advanced and reliable products increases, the demand for this chip model is likely to increase as well.
The original design intention of the chip model EPF10K130EFI484-2 is to provide superior performance, reliability, and flexibility. This chip model is designed to be used in a variety of industries and applications, and it is also designed to be used in a variety of scenarios, such as digital signal processing, embedded systems, and system-on-chip (SoC) designs. The chip model is designed to be upgradable and can be used in future applications and scenarios.
The chip model EPF10K130EFI484-2 can be used in a variety of applications and scenarios, including networks and intelligent systems. This chip model can be used in a variety of networks, such as wireless networks, and it can also be used in a variety of intelligent systems, such as artificial intelligence (AI) and machine learning (ML). This chip model is designed to be upgradable and can be used in future applications and scenarios.
The chip model EPF10K130EFI484-2 is designed to be used in the era of fully intelligent systems. This chip model can be used in a variety of intelligent systems, such as AI and ML, and it can also be used in a variety of applications and scenarios, such as networks and intelligent systems. This chip model is designed to be upgradable and can be used in future applications and scenarios.
In conclusion, the chip model EPF10K130EFI484-2 is a highly integrated programmable logic device that is designed to provide superior performance, reliability, and flexibility. This chip model can be used in a variety of industries and applications, and it is designed to be used in a variety of scenarios, such as digital signal processing, embedded systems, and system-on-chip (SoC) designs. The expected demand for this chip model is likely to continue to increase in the future, and it is also designed to be used in a variety of applications, including networks and intelligent systems. This chip model is designed to be upgradable and can be used in future applications and scenarios. It is also designed to be used in the era of fully intelligent systems.
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1,082 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $295.2601 | $295.2601 |
| 10+ | $292.0853 | $2,920.8528 |
| 100+ | $276.2111 | $27,621.1080 |
| 1000+ | $260.3369 | $130,168.4400 |
| 10000+ | $238.1130 | $238,113.0000 |
| The price is for reference only, please refer to the actual quotation! | ||